TY - JOUR
T1 - Lifetime prediction of solder materials
AU - Zubelewicz, A.
AU - Berriche, R.
AU - Keer, Leon M
AU - Fine, M. E.
PY - 1988/12/1
Y1 - 1988/12/1
N2 - Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not fit the experimental data. The phenomenon correlates with a change in failure mode of transgranular and mixed for higher strain ranges, and intergranular at lower strains. The modeling incorporates the appropriate micromechanical features, and in addition shows that the variation in the failure mode and in the magnitude of the stresses from varying strain range (during the cyclic process) coincide with each other.
AB - Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not fit the experimental data. The phenomenon correlates with a change in failure mode of transgranular and mixed for higher strain ranges, and intergranular at lower strains. The modeling incorporates the appropriate micromechanical features, and in addition shows that the variation in the failure mode and in the magnitude of the stresses from varying strain range (during the cyclic process) coincide with each other.
UR - http://www.scopus.com/inward/record.url?scp=18844476448&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=18844476448&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:18844476448
SN - 0402-1215
JO - American Society of Mechanical Engineers (Paper)
JF - American Society of Mechanical Engineers (Paper)
T2 - Preprint - American Society of Mechanical Engineers
Y2 - 27 November 1988 through 2 December 1988
ER -