Lifetime prediction of solder materials

A. Zubelewicz*, R. Berriche, Leon M Keer, M. E. Fine

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not fit the experimental data. The phenomenon correlates with a change in failure mode of transgranular and mixed for higher strain ranges, and intergranular at lower strains. The modeling incorporates the appropriate micromechanical features, and in addition shows that the variation in the failure mode and in the magnitude of the stresses from varying strain range (during the cyclic process) coincide with each other.

Original languageEnglish (US)
JournalAmerican Society of Mechanical Engineers (Paper)
StatePublished - Dec 1 1988
EventPreprint - American Society of Mechanical Engineers - Chicago, IL, USA
Duration: Nov 27 1988Dec 2 1988

ASJC Scopus subject areas

  • Mechanical Engineering

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