Lifetime prediction of solder materials

A. Zubelewicz; R. Berriche; L. M. Keer; M. E. Fine

Lifetime prediction of solder materials

A. Zubelewicz^*, R. Berriche, L. M. Keer, M. E. Fine

^*Corresponding author for this work

Civil and Environmental Engineering

Research output: Contribution to journal › Conference article › peer-review

1 Scopus citations

Abstract

Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not fit the experimental data. The phenomenon correlates with a change in failure mode of transgranular and mixed for higher strain ranges, and intergranular at lower strains. The modeling incorporates the appropriate micromechanical features, and in addition shows that the variation in the failure mode and in the magnitude of the stresses from varying strain range (during the cyclic process) coincide with each other.

Original language	English (US)
Pages (from-to)	WA/EEP11 5
Journal	American Society of Mechanical Engineers (Paper)
State	Published - 1988
Event	Preprint - American Society of Mechanical Engineers - Chicago, IL, USA Duration: Nov 27 1988 → Dec 2 1988

ASJC Scopus subject areas

Mechanical Engineering

Cite this

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title = "Lifetime prediction of solder materials",

abstract = "Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not fit the experimental data. The phenomenon correlates with a change in failure mode of transgranular and mixed for higher strain ranges, and intergranular at lower strains. The modeling incorporates the appropriate micromechanical features, and in addition shows that the variation in the failure mode and in the magnitude of the stresses from varying strain range (during the cyclic process) coincide with each other.",

author = "A. Zubelewicz and R. Berriche and Keer, {L. M.} and Fine, {M. E.}",

year = "1988",

language = "English (US)",

pages = "WA/EEP11 5",

journal = "American Society of Mechanical Engineers (Paper)",

issn = "0402-1215",

note = "Preprint - American Society of Mechanical Engineers ; Conference date: 27-11-1988 Through 02-12-1988",

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TY - JOUR

T1 - Lifetime prediction of solder materials

AU - Zubelewicz, A.

AU - Berriche, R.

AU - Keer, L. M.

AU - Fine, M. E.

PY - 1988

Y1 - 1988

N2 - Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not fit the experimental data. The phenomenon correlates with a change in failure mode of transgranular and mixed for higher strain ranges, and intergranular at lower strains. The modeling incorporates the appropriate micromechanical features, and in addition shows that the variation in the failure mode and in the magnitude of the stresses from varying strain range (during the cyclic process) coincide with each other.

AB - Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not fit the experimental data. The phenomenon correlates with a change in failure mode of transgranular and mixed for higher strain ranges, and intergranular at lower strains. The modeling incorporates the appropriate micromechanical features, and in addition shows that the variation in the failure mode and in the magnitude of the stresses from varying strain range (during the cyclic process) coincide with each other.

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UR - http://www.scopus.com/inward/citedby.url?scp=18844476448&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:18844476448

SN - 0402-1215

SP - WA/EEP11 5

JO - American Society of Mechanical Engineers (Paper)

JF - American Society of Mechanical Engineers (Paper)

T2 - Preprint - American Society of Mechanical Engineers

Y2 - 27 November 1988 through 2 December 1988

ER -

Lifetime prediction of solder materials

Abstract

ASJC Scopus subject areas

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