Manipulation of nanoparticles and biomolecules by electric field and surface tension

Yaling Liu, Kieseok Oh, John G. Bai, Cheng Ling Chang, Woonhoog Yeo, Jae Hyun Chung, Kyong Hoon Lee, Wing Kam Liu*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

48 Scopus citations

Abstract

Electric field has become one of the most widely used tools for manipulating cells, biomolecules, and nanoscale particles in microfluidic devices. This paper presents the theory, modeling, and experimental works on manipulation of nano and biomaterials by using an electric field and surface tension. Three-dimensional dynamic assembly of nanowires on various microelectrodes under dielectrophoretic force is presented with discussion on capillary action and electroosmosis effects in the manipulation. The various approaches to manipulate the small scale materials are addressed both numerically and experimentally. For successful prediction and analysis on nanoscale, a hierarchical and multiscale scheme for modeling fluid transportation in nanochannels is suggested. The results show that the combined effects of electric field and capillary action induced forces are crucial for precise control over nanoscale materials.

Original languageEnglish (US)
Pages (from-to)2156-2172
Number of pages17
JournalComputer Methods in Applied Mechanics and Engineering
Volume197
Issue number25-28
DOIs
StatePublished - Apr 15 2008

Funding

The support of this research by the National Science Foundation (NSF), Office of Naval Research (ONR), and the NSF Summer Institute on Nano Mechanics and Materials is gratefully acknowledged. The device fabrication has been performed in the microfabrication laboratory of Washington Technology Center and NanoTech User Facility at University of Washington.

Keywords

  • Dielectrophoretic assembly
  • Electrokinetics
  • Immersed finite element method
  • Nanochannel
  • Nanomaterials
  • Nanowires
  • Surface tension

ASJC Scopus subject areas

  • Computational Mechanics
  • Mechanics of Materials
  • Mechanical Engineering
  • General Physics and Astronomy
  • Computer Science Applications

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