Manufacturing at nanoscale: Top-down, bottom-up and system engineering

Xiang Zhang*, Cheng Sun, Nicholas Fang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

25 Scopus citations

Abstract

The current nano-technology revolution is facing several major challenges: to manufacture nanodevices below 20 nm, to fabricate three-dimensional complex nano-structures, and to heterogeneously integrate multiple functionalities. To tackle these grand challenges, the Center for Scalable and Integrated NAno-Manufacturing (SINAM), a NSF Nanoscale Science and Engineering Center, set its goal to establish a new manufacturing paradigm that integrates an array of new nano-manufacturing technologies, including the plasmonic imaging lithography and ultramolding imprint lithography aiming toward critical resolution of 1-10 nm and the hybrid top-down and bottom-up technologies to achieve massively parallel integration of heterogeneous nanoscale components into higher-order structures and devices. Furthermore, SINAM will develop system engineering strategies to scale-up the nano-manufacturing technologies. SINAMs integrated research and education platform will shed light to a broad range of potential applications in computing, telecommunication, photonics, biotechnology, health care, and national security.

Original languageEnglish (US)
Pages (from-to)125-130
Number of pages6
JournalJournal of Nanoparticle Research
Volume6
Issue number1
DOIs
StatePublished - Feb 2004

Keywords

  • Hybrid top-down and bottom-up process
  • Manufacturing
  • Nanoscale
  • Plasmonic imaging lithography
  • System engineering
  • Ultra-molding and imprinting

ASJC Scopus subject areas

  • Bioengineering
  • Chemistry(all)
  • Atomic and Molecular Physics, and Optics
  • Modeling and Simulation
  • Materials Science(all)
  • Condensed Matter Physics

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