Materials and patterning techniques for macroelectronics

Yugang Sun; Shawn Mack; Matthew Meitl; John A. Rogers

Materials and patterning techniques for macroelectronics

Yugang Sun^*, Shawn Mack, Matthew Meitl, John A. Rogers

^*Corresponding author for this work

Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Flexible thin film transistors (TFTs) with high performance can be fabricated by using printable arrays of microstructured Si ribbons or GaAs wires (μs-Si or μs-GaAs) generated from high-quality, single-crystal, bulk wafers. The resulting Si-based MOSFETs and GaAs-based MESFETs on thin plastic substrates exhibit excellent electrical and mechanical (i.e. bending) properties. The combined use of these materials and printing techniques may advance the development of practical technologies for emerging applications of lightweight, flexible 'macroelectronic' systems in consumer, space, and military applications.

Original language	English (US)
Title of host publication	IEEE International Electron Devices Meeting, 2005 IEDM - Technical Digest
Pages	454-457
Number of pages	4
Volume	2005
State	Published - Dec 1 2005
Event	IEEE International Electron Devices Meeting, 2005 IEDM - Washington, DC, MD, United States Duration: Dec 5 2005 → Dec 7 2005

Other

Other	IEEE International Electron Devices Meeting, 2005 IEDM
Country/Territory	United States
City	Washington, DC, MD
Period	12/5/05 → 12/7/05

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Cite this

@inproceedings{309d4694541f43e0afdfe4f3da142c30,

title = "Materials and patterning techniques for macroelectronics",

abstract = "Flexible thin film transistors (TFTs) with high performance can be fabricated by using printable arrays of microstructured Si ribbons or GaAs wires (μs-Si or μs-GaAs) generated from high-quality, single-crystal, bulk wafers. The resulting Si-based MOSFETs and GaAs-based MESFETs on thin plastic substrates exhibit excellent electrical and mechanical (i.e. bending) properties. The combined use of these materials and printing techniques may advance the development of practical technologies for emerging applications of lightweight, flexible 'macroelectronic' systems in consumer, space, and military applications.",

author = "Yugang Sun and Shawn Mack and Matthew Meitl and Rogers, {John A.}",

year = "2005",

month = dec,

day = "1",

language = "English (US)",

isbn = "078039268X",

volume = "2005",

pages = "454--457",

booktitle = "IEEE International Electron Devices Meeting, 2005 IEDM - Technical Digest",

note = "IEEE International Electron Devices Meeting, 2005 IEDM ; Conference date: 05-12-2005 Through 07-12-2005",

}

TY - GEN

T1 - Materials and patterning techniques for macroelectronics

AU - Sun, Yugang

AU - Mack, Shawn

AU - Meitl, Matthew

AU - Rogers, John A.

PY - 2005/12/1

Y1 - 2005/12/1

N2 - Flexible thin film transistors (TFTs) with high performance can be fabricated by using printable arrays of microstructured Si ribbons or GaAs wires (μs-Si or μs-GaAs) generated from high-quality, single-crystal, bulk wafers. The resulting Si-based MOSFETs and GaAs-based MESFETs on thin plastic substrates exhibit excellent electrical and mechanical (i.e. bending) properties. The combined use of these materials and printing techniques may advance the development of practical technologies for emerging applications of lightweight, flexible 'macroelectronic' systems in consumer, space, and military applications.

AB - Flexible thin film transistors (TFTs) with high performance can be fabricated by using printable arrays of microstructured Si ribbons or GaAs wires (μs-Si or μs-GaAs) generated from high-quality, single-crystal, bulk wafers. The resulting Si-based MOSFETs and GaAs-based MESFETs on thin plastic substrates exhibit excellent electrical and mechanical (i.e. bending) properties. The combined use of these materials and printing techniques may advance the development of practical technologies for emerging applications of lightweight, flexible 'macroelectronic' systems in consumer, space, and military applications.

UR - http://www.scopus.com/inward/record.url?scp=33847709887&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33847709887&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:33847709887

SN - 078039268X

SN - 9780780392687

VL - 2005

SP - 454

EP - 457

BT - IEEE International Electron Devices Meeting, 2005 IEDM - Technical Digest

T2 - IEEE International Electron Devices Meeting, 2005 IEDM

Y2 - 5 December 2005 through 7 December 2005

ER -

Materials and patterning techniques for macroelectronics

Abstract

Other

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this