Measurement of the intrinsic bond strength of brittle thin films on flexible substrates

Q. Guo*, H. Osaki, Leon M Keer, D. R. Wheeler

*Corresponding author for this work

Research output: Contribution to journalArticle

19 Scopus citations

Abstract

The brittle cracking and subsequent debonding of nickel films deposited on polymer substrates subjected to uniaxial strain is investigated. Stress analyses for a film/substrate system are performed. Based on the analysis, the interfacial bond strength between brittle thin films and flexible substrates can be evaluated in terms of the tensile strength of the coating and the length of the largest segment that first debonds. Experiments were performed on Ni films with different thicknesses evaporated on polyethylene terephthalate substrates and the intrinsic bond strength was evaluated. The interfacial bond strengths were shown to be relatively independent of the film thickness for the range studied.

Original languageEnglish (US)
Pages (from-to)1649-1654
Number of pages6
JournalJournal of Applied Physics
Volume68
Issue number4
DOIs
StatePublished - Dec 1 1990

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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