Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials

Zheng Yan, Fan Zhang, Fei Liu, Mengdi Han, Dapeng Ou, Yuhao Liu, Qing Lin, Xuelin Guo, Haoran Fu, Zhaoqian Xie, Mingye Gao, Yuming Huang, Jung Hwan Kim, Yitao Qiu, Kewang Nan, Jeonghyun Kim, Philipp Gutruf, Hongying Luo, An Zhao, Keh Chih Hwang & 3 others Yonggang Huang, Yihui Zhang, John A. Rogers

Research output: Contribution to journalArticle

66 Citations (Scopus)

Abstract

Capabilities for assembly of three-dimensional (3D) micro/nanostructures in advanced materials have important implications across a broad range of application areas, reaching nearly every class of microsystem technology. Approaches that rely on the controlled, compressive buckling of 2D precursors are promising because of their demonstrated compatibility with the most sophisticated planar technologies, where materials include inorganic semiconductors, polymers, metals, and various heterogeneous combinations, spanning length scales from submicrometer to centimeter dimensions. We introduce a set of fabrication techniques and design concepts that bypass certain constraints set by the underlying physics and geometrical properties of the assembly processes associated with the original versions of these methods. In particular, the use of releasable, multilayer 2D precursors provides access to complex 3D topologies, including dense architectures with nested layouts, controlled points of entanglement, and other previously unobtainable layouts. Furthermore, the simultaneous, coordinated assembly of additional structures can enhance the structural stability and drive the motion of extended features in these systems. The resulting 3D mesostructures, demonstrated in a diverse set of more than 40 different examples with feature sizes from micrometers to centimeters, offer unique possibilities in device design. A 3D spiral inductor for near-field communication represents an example where these ideas enable enhanced quality (Q) factors and broader working angles compared to those of conventional 2D counterparts.

Original languageEnglish (US)
Article numbere1601014
JournalScience advances
Volume2
Issue number9
DOIs
StatePublished - Sep 1 2016

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Technology
Equipment Design
Semiconductors
Nanostructures
Physics
Polymers
Metals

ASJC Scopus subject areas

  • General

Cite this

Yan, Zheng ; Zhang, Fan ; Liu, Fei ; Han, Mengdi ; Ou, Dapeng ; Liu, Yuhao ; Lin, Qing ; Guo, Xuelin ; Fu, Haoran ; Xie, Zhaoqian ; Gao, Mingye ; Huang, Yuming ; Kim, Jung Hwan ; Qiu, Yitao ; Nan, Kewang ; Kim, Jeonghyun ; Gutruf, Philipp ; Luo, Hongying ; Zhao, An ; Hwang, Keh Chih ; Huang, Yonggang ; Zhang, Yihui ; Rogers, John A. / Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials. In: Science advances. 2016 ; Vol. 2, No. 9.
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abstract = "Capabilities for assembly of three-dimensional (3D) micro/nanostructures in advanced materials have important implications across a broad range of application areas, reaching nearly every class of microsystem technology. Approaches that rely on the controlled, compressive buckling of 2D precursors are promising because of their demonstrated compatibility with the most sophisticated planar technologies, where materials include inorganic semiconductors, polymers, metals, and various heterogeneous combinations, spanning length scales from submicrometer to centimeter dimensions. We introduce a set of fabrication techniques and design concepts that bypass certain constraints set by the underlying physics and geometrical properties of the assembly processes associated with the original versions of these methods. In particular, the use of releasable, multilayer 2D precursors provides access to complex 3D topologies, including dense architectures with nested layouts, controlled points of entanglement, and other previously unobtainable layouts. Furthermore, the simultaneous, coordinated assembly of additional structures can enhance the structural stability and drive the motion of extended features in these systems. The resulting 3D mesostructures, demonstrated in a diverse set of more than 40 different examples with feature sizes from micrometers to centimeters, offer unique possibilities in device design. A 3D spiral inductor for near-field communication represents an example where these ideas enable enhanced quality (Q) factors and broader working angles compared to those of conventional 2D counterparts.",
author = "Zheng Yan and Fan Zhang and Fei Liu and Mengdi Han and Dapeng Ou and Yuhao Liu and Qing Lin and Xuelin Guo and Haoran Fu and Zhaoqian Xie and Mingye Gao and Yuming Huang and Kim, {Jung Hwan} and Yitao Qiu and Kewang Nan and Jeonghyun Kim and Philipp Gutruf and Hongying Luo and An Zhao and Hwang, {Keh Chih} and Yonggang Huang and Yihui Zhang and Rogers, {John A.}",
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Yan, Z, Zhang, F, Liu, F, Han, M, Ou, D, Liu, Y, Lin, Q, Guo, X, Fu, H, Xie, Z, Gao, M, Huang, Y, Kim, JH, Qiu, Y, Nan, K, Kim, J, Gutruf, P, Luo, H, Zhao, A, Hwang, KC, Huang, Y, Zhang, Y & Rogers, JA 2016, 'Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials' Science advances, vol. 2, no. 9, e1601014. https://doi.org/10.1126/sciadv.1601014

Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials. / Yan, Zheng; Zhang, Fan; Liu, Fei; Han, Mengdi; Ou, Dapeng; Liu, Yuhao; Lin, Qing; Guo, Xuelin; Fu, Haoran; Xie, Zhaoqian; Gao, Mingye; Huang, Yuming; Kim, Jung Hwan; Qiu, Yitao; Nan, Kewang; Kim, Jeonghyun; Gutruf, Philipp; Luo, Hongying; Zhao, An; Hwang, Keh Chih; Huang, Yonggang; Zhang, Yihui; Rogers, John A.

In: Science advances, Vol. 2, No. 9, e1601014, 01.09.2016.

Research output: Contribution to journalArticle

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T1 - Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials

AU - Yan, Zheng

AU - Zhang, Fan

AU - Liu, Fei

AU - Han, Mengdi

AU - Ou, Dapeng

AU - Liu, Yuhao

AU - Lin, Qing

AU - Guo, Xuelin

AU - Fu, Haoran

AU - Xie, Zhaoqian

AU - Gao, Mingye

AU - Huang, Yuming

AU - Kim, Jung Hwan

AU - Qiu, Yitao

AU - Nan, Kewang

AU - Kim, Jeonghyun

AU - Gutruf, Philipp

AU - Luo, Hongying

AU - Zhao, An

AU - Hwang, Keh Chih

AU - Huang, Yonggang

AU - Zhang, Yihui

AU - Rogers, John A.

PY - 2016/9/1

Y1 - 2016/9/1

N2 - Capabilities for assembly of three-dimensional (3D) micro/nanostructures in advanced materials have important implications across a broad range of application areas, reaching nearly every class of microsystem technology. Approaches that rely on the controlled, compressive buckling of 2D precursors are promising because of their demonstrated compatibility with the most sophisticated planar technologies, where materials include inorganic semiconductors, polymers, metals, and various heterogeneous combinations, spanning length scales from submicrometer to centimeter dimensions. We introduce a set of fabrication techniques and design concepts that bypass certain constraints set by the underlying physics and geometrical properties of the assembly processes associated with the original versions of these methods. In particular, the use of releasable, multilayer 2D precursors provides access to complex 3D topologies, including dense architectures with nested layouts, controlled points of entanglement, and other previously unobtainable layouts. Furthermore, the simultaneous, coordinated assembly of additional structures can enhance the structural stability and drive the motion of extended features in these systems. The resulting 3D mesostructures, demonstrated in a diverse set of more than 40 different examples with feature sizes from micrometers to centimeters, offer unique possibilities in device design. A 3D spiral inductor for near-field communication represents an example where these ideas enable enhanced quality (Q) factors and broader working angles compared to those of conventional 2D counterparts.

AB - Capabilities for assembly of three-dimensional (3D) micro/nanostructures in advanced materials have important implications across a broad range of application areas, reaching nearly every class of microsystem technology. Approaches that rely on the controlled, compressive buckling of 2D precursors are promising because of their demonstrated compatibility with the most sophisticated planar technologies, where materials include inorganic semiconductors, polymers, metals, and various heterogeneous combinations, spanning length scales from submicrometer to centimeter dimensions. We introduce a set of fabrication techniques and design concepts that bypass certain constraints set by the underlying physics and geometrical properties of the assembly processes associated with the original versions of these methods. In particular, the use of releasable, multilayer 2D precursors provides access to complex 3D topologies, including dense architectures with nested layouts, controlled points of entanglement, and other previously unobtainable layouts. Furthermore, the simultaneous, coordinated assembly of additional structures can enhance the structural stability and drive the motion of extended features in these systems. The resulting 3D mesostructures, demonstrated in a diverse set of more than 40 different examples with feature sizes from micrometers to centimeters, offer unique possibilities in device design. A 3D spiral inductor for near-field communication represents an example where these ideas enable enhanced quality (Q) factors and broader working angles compared to those of conventional 2D counterparts.

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