Mechanical damping using adhesive micro or nano powders

B. L. Severson, L. M. Keer, J. M. Ottino, R. Q. Snurr*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

A particle dynamics simulation model is developed and used to design a mechanical damping device that uses micro or nano powders as the damping medium. A damping device based on a powder has the advantage over the traditional use of a viscous fluid of temperature insensitive operation. Adhesion forces significantly affect the behavior of small particles. The damping mechanism targeted stems from energy dissipated due to the breaking of many adhesive particle contacts. Adhesive contacts can dissipate energy due to hysteresis in the force between particle loading and unloading. In this work adhesion hysteresis is added to the JKR model of adhesive contact and then used in particle dynamics simulations. The effects of adhesive properties and packing densities are studied in two device geometries (shear and piston) using simulation.

Original languageEnglish (US)
Pages (from-to)143-148
Number of pages6
JournalPowder Technology
Volume191
Issue number1-2
DOIs
StatePublished - Apr 4 2009

Keywords

  • Adhesion
  • JKR
  • Particle damping
  • Particle dynamics

ASJC Scopus subject areas

  • Chemical Engineering(all)

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