Mechanical properties database and fatigue lifetime prediction for solders

Jason Chin*, Hareesh Mavoori, Morris Fine, Brian Moran, Leon M Keer

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Abstract

A unified creep-plasticity (UCP) model for predicting the failure behavior of solder interconnects has been developed using a mechanical property database at Northwestern University. The model uses data collected from the early stages of testing conducted under unaltered conditions to ensure that none of the failure mechanisms are affected. It has been used successfully in predicting the thermomechanical fatigue behavior of several classes of eutectic solders.

Original languageEnglish (US)
Pages (from-to)15-23
Number of pages9
JournalNational Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)
Volume1
StatePublished - Jan 1 1997
EventProceedings of the NEPCON WEST'97. Part 3 (of 3) - Anaheim, CA, USA
Duration: Feb 23 1997Feb 27 1997

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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