@article{7a29dbbe6a064b17a7980759efd916a8,
title = "Mechanically Guided Hierarchical Assembly of 3D Mesostructures",
abstract = "3D, hierarchical micro/nanostructures formed with advanced functional materials are of growing interest due to their broad potential utility in electronics, robotics, battery technology, and biomedical engineering. Among various strategies in 3D micro/nanofabrication, a set of methods based on compressive buckling offers wide-ranging material compatibility, fabrication scalability, and precise process control. Previously reports on this type of approach rely on a single, planar prestretched elastomeric platform to transform thin-film precursors with 2D layouts into 3D architectures. The simple planar configuration of bonding sites between these precursors and their assembly substrates prevents the realization of certain types of complex 3D geometries. In this paper, a set of hierarchical assembly concepts is reported that leverage multiple layers of prestretched elastomeric substrates to induce not only compressive buckling of 2D precursors bonded to them but also of themselves, thereby creating 3D mesostructures mounted at multiple levels of 3D frameworks with complex, elaborate configurations. Control over strains used in these processes provides reversible access to multiple different 3D layouts in a given structure. Examples to demonstrate these ideas through both experimental and computational results span vertically aligned helices to closed 3D cages, selected for their relevance to 3D conformal bio-interfaces and multifunctional microsystems.",
keywords = "3D fabrication, buckling, hierarchical structures, kirigami, origami",
author = "Hangbo Zhao and Xu Cheng and Changsheng Wu and Liu, {Tzu Li} and Qinai Zhao and Shuo Li and Xinchen Ni and Shenglian Yao and Mengdi Han and Yonggang Huang and Yihui Zhang and Rogers, {John A.}",
note = "Funding Information: H.Z., X.C., and C.W. contributed equally to this work. The team acknowledges support from the Querrey Simpson Institute for Bioelectronics at Northwestern University and from the Biotronics Program through the US Army. H.Z. acknowledges support from the Viterbi School of Engineering at the University of Southern California. Y.Z. acknowledges support from the National Natural Science Foundation of China (Grant Nos. 12050004 and 11921002), the Henry Fok Education Foundation, and the Tsinghua National Laboratory for Information Science. This work utilized Northwestern University Micro/Nano Fabrication Facility (NUFAB), which was partially supported by Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource (NSF ECCS‐1542205), the Materials Research Science and Engineering Center (DMR‐1720139), the State of Illinois, and Northwestern University. Funding Information: H.Z., X.C., and C.W. contributed equally to this work. The team acknowledges support from the Querrey Simpson Institute for Bioelectronics at Northwestern University and from the Biotronics Program through the US Army. H.Z. acknowledges support from the Viterbi School of Engineering at the University of Southern California. Y.Z. acknowledges support from the National Natural Science Foundation of China (Grant Nos. 12050004 and 11921002), the Henry Fok Education Foundation, and the Tsinghua National Laboratory for Information Science. This work utilized Northwestern University Micro/Nano Fabrication Facility (NUFAB), which was partially supported by Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource (NSF ECCS-1542205), the Materials Research Science and Engineering Center (DMR-1720139), the State of Illinois, and Northwestern University. Publisher Copyright: {\textcopyright} 2022 Wiley-VCH GmbH.",
year = "2022",
month = mar,
day = "24",
doi = "10.1002/adma.202109416",
language = "English (US)",
volume = "34",
journal = "Advanced Materials",
issn = "0935-9648",
publisher = "Wiley-VCH Verlag",
number = "12",
}