Mechanically Guided Post-Assembly of 3D Electronic Systems

Bong Hoon Kim, Fei Liu, Yongjoon Yu, Hokyung Jang, Zhaoqian Xie, Kan Li, Jungyup Lee, Ji Yoon Jeong, Arin Ryu, Yechan Lee, Do Hoon Kim, Xueju Wang, Kun Hyuck Lee, Jong Yoon Lee, Sang Min Won, Nuri Oh, Jeonghyun Kim, Ju Young Kim, Seong Jun Jeong, Kyung In JangSeungmin Lee, Yonggang Huang*, Yihui Zhang, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

51 Scopus citations


This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out-of-plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near-field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components.

Original languageEnglish (US)
Article number1803149
JournalAdvanced Functional Materials
Issue number48
StatePublished - Nov 28 2018


  • 3D electronic devices
  • kirigami
  • mechanical buckling
  • near-field communication
  • origami

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • General Chemistry
  • General Materials Science
  • Electrochemistry
  • Biomaterials


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