Mechanically Guided Post-Assembly of 3D Electronic Systems

Bong Hoon Kim, Fei Liu, Yongjoon Yu, Hokyung Jang, Zhaoqian Xie, Kan Li, Jungyup Lee, Ji Yoon Jeong, Arin Ryu, Yechan Lee, Do Hoon Kim, Xueju Wang, Kun Hyuck Lee, Jong Yoon Lee, Sang Min Won, Nuri Oh, Jeonghyun Kim, Ju Young Kim, Seong Jun Jeong, Kyung In Jang & 4 others Seungmin Lee, Yonggang Huang*, Yihui Zhang, John A Rogers

*Corresponding author for this work

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out-of-plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near-field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components.

Original languageEnglish (US)
Article number1803149
JournalAdvanced Functional Materials
Volume28
Issue number48
DOIs
StatePublished - Nov 28 2018

Fingerprint

printed circuits
circuit boards
Printed circuit boards
assembly
electronics
platforms
Elastomers
Geometry
electromagnetic properties
elastic deformation
Elastic deformation
elastomers
Substrates
buckling
geometry
shelves
Optoelectronic devices
layouts
Buckling
slits

Keywords

  • 3D electronic devices
  • kirigami
  • mechanical buckling
  • near-field communication
  • origami

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Kim, Bong Hoon ; Liu, Fei ; Yu, Yongjoon ; Jang, Hokyung ; Xie, Zhaoqian ; Li, Kan ; Lee, Jungyup ; Jeong, Ji Yoon ; Ryu, Arin ; Lee, Yechan ; Kim, Do Hoon ; Wang, Xueju ; Lee, Kun Hyuck ; Lee, Jong Yoon ; Won, Sang Min ; Oh, Nuri ; Kim, Jeonghyun ; Kim, Ju Young ; Jeong, Seong Jun ; Jang, Kyung In ; Lee, Seungmin ; Huang, Yonggang ; Zhang, Yihui ; Rogers, John A. / Mechanically Guided Post-Assembly of 3D Electronic Systems. In: Advanced Functional Materials. 2018 ; Vol. 28, No. 48.
@article{e487f2e2f19345d5a6877b5f04f67cde,
title = "Mechanically Guided Post-Assembly of 3D Electronic Systems",
abstract = "This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out-of-plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near-field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components.",
keywords = "3D electronic devices, kirigami, mechanical buckling, near-field communication, origami",
author = "Kim, {Bong Hoon} and Fei Liu and Yongjoon Yu and Hokyung Jang and Zhaoqian Xie and Kan Li and Jungyup Lee and Jeong, {Ji Yoon} and Arin Ryu and Yechan Lee and Kim, {Do Hoon} and Xueju Wang and Lee, {Kun Hyuck} and Lee, {Jong Yoon} and Won, {Sang Min} and Nuri Oh and Jeonghyun Kim and Kim, {Ju Young} and Jeong, {Seong Jun} and Jang, {Kyung In} and Seungmin Lee and Yonggang Huang and Yihui Zhang and Rogers, {John A}",
year = "2018",
month = "11",
day = "28",
doi = "10.1002/adfm.201803149",
language = "English (US)",
volume = "28",
journal = "Advanced Functional Materials",
issn = "1616-301X",
publisher = "Wiley-VCH Verlag",
number = "48",

}

Kim, BH, Liu, F, Yu, Y, Jang, H, Xie, Z, Li, K, Lee, J, Jeong, JY, Ryu, A, Lee, Y, Kim, DH, Wang, X, Lee, KH, Lee, JY, Won, SM, Oh, N, Kim, J, Kim, JY, Jeong, SJ, Jang, KI, Lee, S, Huang, Y, Zhang, Y & Rogers, JA 2018, 'Mechanically Guided Post-Assembly of 3D Electronic Systems', Advanced Functional Materials, vol. 28, no. 48, 1803149. https://doi.org/10.1002/adfm.201803149

Mechanically Guided Post-Assembly of 3D Electronic Systems. / Kim, Bong Hoon; Liu, Fei; Yu, Yongjoon; Jang, Hokyung; Xie, Zhaoqian; Li, Kan; Lee, Jungyup; Jeong, Ji Yoon; Ryu, Arin; Lee, Yechan; Kim, Do Hoon; Wang, Xueju; Lee, Kun Hyuck; Lee, Jong Yoon; Won, Sang Min; Oh, Nuri; Kim, Jeonghyun; Kim, Ju Young; Jeong, Seong Jun; Jang, Kyung In; Lee, Seungmin; Huang, Yonggang; Zhang, Yihui; Rogers, John A.

In: Advanced Functional Materials, Vol. 28, No. 48, 1803149, 28.11.2018.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Mechanically Guided Post-Assembly of 3D Electronic Systems

AU - Kim, Bong Hoon

AU - Liu, Fei

AU - Yu, Yongjoon

AU - Jang, Hokyung

AU - Xie, Zhaoqian

AU - Li, Kan

AU - Lee, Jungyup

AU - Jeong, Ji Yoon

AU - Ryu, Arin

AU - Lee, Yechan

AU - Kim, Do Hoon

AU - Wang, Xueju

AU - Lee, Kun Hyuck

AU - Lee, Jong Yoon

AU - Won, Sang Min

AU - Oh, Nuri

AU - Kim, Jeonghyun

AU - Kim, Ju Young

AU - Jeong, Seong Jun

AU - Jang, Kyung In

AU - Lee, Seungmin

AU - Huang, Yonggang

AU - Zhang, Yihui

AU - Rogers, John A

PY - 2018/11/28

Y1 - 2018/11/28

N2 - This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out-of-plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near-field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components.

AB - This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out-of-plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near-field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components.

KW - 3D electronic devices

KW - kirigami

KW - mechanical buckling

KW - near-field communication

KW - origami

UR - http://www.scopus.com/inward/record.url?scp=85053807885&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85053807885&partnerID=8YFLogxK

U2 - 10.1002/adfm.201803149

DO - 10.1002/adfm.201803149

M3 - Article

VL - 28

JO - Advanced Functional Materials

JF - Advanced Functional Materials

SN - 1616-301X

IS - 48

M1 - 1803149

ER -