TY - JOUR
T1 - Mechanics-coupled stability of metal-halide perovskites
AU - Tu, Qing
AU - Kim, Doyun
AU - Shyikh, Mohammed
AU - Kanatzidis, Mercouri G.
N1 - Funding Information:
This work was supported by the startup fund from Texas A&M Engineering and Experimental Station (TEES) to Q.T., and Texas A&M Triads for Transformation (T3) seed grant. M.G.K. acknowledges support from ONR (N00014-20-2725).
Publisher Copyright:
© 2021 Elsevier Inc.
PY - 2021/9/1
Y1 - 2021/9/1
N2 - Metal-halide perovskites (MHPs) possess enormous potential in optoelectronic and semiconductor devices. In these applications, MHPs are often subjected to mechanical stress, resulting in distorted lattice, severe degradation, and catastrophic failure in MHPs and their interfaces. Understanding these mechanics-coupled stability issues is crucial to the durability and, thus, commercial viability of MHP-based devices. Here, we review the impact of mechanical stress on the integrity and robustness of MHP devices to provide insights into mitigating the mechanics-coupled stability issues. We start with an overview of the structure-elastic-property relationship of MHPs, after which we discuss the current understanding of the cohesive and adhesive failures within MHPs and at MHP interfaces forced by mechanical stress, respectively. We further review the chemical stability issues of MHPs and interfaces induced by the mechanical strain. Finally, we summarize the existing strategies to mitigate the mechanics-coupled stability issues and conclude with an outlook of future research directions.
AB - Metal-halide perovskites (MHPs) possess enormous potential in optoelectronic and semiconductor devices. In these applications, MHPs are often subjected to mechanical stress, resulting in distorted lattice, severe degradation, and catastrophic failure in MHPs and their interfaces. Understanding these mechanics-coupled stability issues is crucial to the durability and, thus, commercial viability of MHP-based devices. Here, we review the impact of mechanical stress on the integrity and robustness of MHP devices to provide insights into mitigating the mechanics-coupled stability issues. We start with an overview of the structure-elastic-property relationship of MHPs, after which we discuss the current understanding of the cohesive and adhesive failures within MHPs and at MHP interfaces forced by mechanical stress, respectively. We further review the chemical stability issues of MHPs and interfaces induced by the mechanical strain. Finally, we summarize the existing strategies to mitigate the mechanics-coupled stability issues and conclude with an outlook of future research directions.
KW - adhesive failure
KW - cohesive fracture
KW - elastic properties
KW - metal halide perovskites
KW - strain-induced instability
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U2 - 10.1016/j.matt.2021.06.028
DO - 10.1016/j.matt.2021.06.028
M3 - Review article
AN - SCOPUS:85122746472
SN - 2590-2393
VL - 4
SP - 2765
EP - 2809
JO - Matter
JF - Matter
IS - 9
ER -