Mechanics design for stretchable, high areal coverage gaas solar module on an ultrathin substrate

Xiaoting Shi, Renxiao Xu, Yuhang Li, Yihui Zhang, Zhigang Ren, Jianfeng Gu, John A. Rogers, Yonggang Huang*

*Corresponding author for this work

Research output: Contribution to journalArticle

17 Scopus citations


The trench design of substrate together with curvy interconnect formed from buckling provides a solution to stretchable electronics with high areal coverage on an ultrathin substrate, which are critically important for stretchable photovoltaics. In this paper, an improved trench design is proposed and verified by finite element analysis (FEA), through use of a heterogeneous design, to facilitate strain isolation and avoid possible fracture/delamination issue. A serpentine design of interconnect is also devised to offer ∼440% interconnect level stretchability, which is >3.5 times that of previous trench design, and could transform into 20% systemlevel stretchability, even for areal coverage as high as ∼90%.

Original languageEnglish (US)
Article number124502
JournalJournal of Applied Mechanics, Transactions ASME
Issue number12
StatePublished - Dec 1 2014



  • High areal coverage
  • Interconnect
  • Strain
  • Substrate
  • Ultrathin

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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