Mechanics of curvilinear electronics

Shuodao Wang, Jianliang Xiao, Jizhou Song, Heung Cho Ko, Keh Chih Hwang, Yonggang Huang*, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticle

42 Citations (Scopus)

Abstract

Advanced methods are now available for conformally wrapping planar, silicon-based electronics circuits onto complex, curvilinear surfaces. Here, buckling physics of circuits configured into mesh geometries consisting of silicon islands interconnected by narrow ribbons leads to out of plane displacements across different parts of the curvilinear surface, in a way that accommodates strains associated with wrapping. The mechanisms for different buckling patterns are identified in this paper. A simple and robust method is established via the following steps to predict the buckling patterns of interconnect bridges for arbitrarily axisymmetric curvilinear surfaces: step 1, obtain analytically the strain distribution on the curvilinear surface; step 2, use the strain distribution from step 1 to determine the buckling patterns of interconnect bridges along different directions and at different locations on the curvilinear surface; and step 3, use the strain distribution from step 1 and buckling pattern from step 2 to obtain analytically the maximum strains in interconnect bridges and device islands. This method is useful to the design and optimization of curvilinear electronics against mechanical and electrical failure.

Original languageEnglish (US)
Pages (from-to)5757-5763
Number of pages7
JournalSoft Matter
Volume6
Issue number22
DOIs
StatePublished - Nov 21 2010

Fingerprint

Buckling
Mechanics
Electronic equipment
buckling
strain distribution
electronics
Silicon
Networks (circuits)
Physics
silicon
ribbons
mesh
Geometry
physics
optimization
geometry

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics

Cite this

Wang, S., Xiao, J., Song, J., Ko, H. C., Hwang, K. C., Huang, Y., & Rogers, J. A. (2010). Mechanics of curvilinear electronics. Soft Matter, 6(22), 5757-5763. https://doi.org/10.1039/c0sm00579g
Wang, Shuodao ; Xiao, Jianliang ; Song, Jizhou ; Ko, Heung Cho ; Hwang, Keh Chih ; Huang, Yonggang ; Rogers, John A. / Mechanics of curvilinear electronics. In: Soft Matter. 2010 ; Vol. 6, No. 22. pp. 5757-5763.
@article{c9dc9abd47c241c1bdd0991e28f2a14a,
title = "Mechanics of curvilinear electronics",
abstract = "Advanced methods are now available for conformally wrapping planar, silicon-based electronics circuits onto complex, curvilinear surfaces. Here, buckling physics of circuits configured into mesh geometries consisting of silicon islands interconnected by narrow ribbons leads to out of plane displacements across different parts of the curvilinear surface, in a way that accommodates strains associated with wrapping. The mechanisms for different buckling patterns are identified in this paper. A simple and robust method is established via the following steps to predict the buckling patterns of interconnect bridges for arbitrarily axisymmetric curvilinear surfaces: step 1, obtain analytically the strain distribution on the curvilinear surface; step 2, use the strain distribution from step 1 to determine the buckling patterns of interconnect bridges along different directions and at different locations on the curvilinear surface; and step 3, use the strain distribution from step 1 and buckling pattern from step 2 to obtain analytically the maximum strains in interconnect bridges and device islands. This method is useful to the design and optimization of curvilinear electronics against mechanical and electrical failure.",
author = "Shuodao Wang and Jianliang Xiao and Jizhou Song and Ko, {Heung Cho} and Hwang, {Keh Chih} and Yonggang Huang and Rogers, {John A.}",
year = "2010",
month = "11",
day = "21",
doi = "10.1039/c0sm00579g",
language = "English (US)",
volume = "6",
pages = "5757--5763",
journal = "Soft Matter",
issn = "1744-683X",
publisher = "Royal Society of Chemistry",
number = "22",

}

Wang, S, Xiao, J, Song, J, Ko, HC, Hwang, KC, Huang, Y & Rogers, JA 2010, 'Mechanics of curvilinear electronics', Soft Matter, vol. 6, no. 22, pp. 5757-5763. https://doi.org/10.1039/c0sm00579g

Mechanics of curvilinear electronics. / Wang, Shuodao; Xiao, Jianliang; Song, Jizhou; Ko, Heung Cho; Hwang, Keh Chih; Huang, Yonggang; Rogers, John A.

In: Soft Matter, Vol. 6, No. 22, 21.11.2010, p. 5757-5763.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Mechanics of curvilinear electronics

AU - Wang, Shuodao

AU - Xiao, Jianliang

AU - Song, Jizhou

AU - Ko, Heung Cho

AU - Hwang, Keh Chih

AU - Huang, Yonggang

AU - Rogers, John A.

PY - 2010/11/21

Y1 - 2010/11/21

N2 - Advanced methods are now available for conformally wrapping planar, silicon-based electronics circuits onto complex, curvilinear surfaces. Here, buckling physics of circuits configured into mesh geometries consisting of silicon islands interconnected by narrow ribbons leads to out of plane displacements across different parts of the curvilinear surface, in a way that accommodates strains associated with wrapping. The mechanisms for different buckling patterns are identified in this paper. A simple and robust method is established via the following steps to predict the buckling patterns of interconnect bridges for arbitrarily axisymmetric curvilinear surfaces: step 1, obtain analytically the strain distribution on the curvilinear surface; step 2, use the strain distribution from step 1 to determine the buckling patterns of interconnect bridges along different directions and at different locations on the curvilinear surface; and step 3, use the strain distribution from step 1 and buckling pattern from step 2 to obtain analytically the maximum strains in interconnect bridges and device islands. This method is useful to the design and optimization of curvilinear electronics against mechanical and electrical failure.

AB - Advanced methods are now available for conformally wrapping planar, silicon-based electronics circuits onto complex, curvilinear surfaces. Here, buckling physics of circuits configured into mesh geometries consisting of silicon islands interconnected by narrow ribbons leads to out of plane displacements across different parts of the curvilinear surface, in a way that accommodates strains associated with wrapping. The mechanisms for different buckling patterns are identified in this paper. A simple and robust method is established via the following steps to predict the buckling patterns of interconnect bridges for arbitrarily axisymmetric curvilinear surfaces: step 1, obtain analytically the strain distribution on the curvilinear surface; step 2, use the strain distribution from step 1 to determine the buckling patterns of interconnect bridges along different directions and at different locations on the curvilinear surface; and step 3, use the strain distribution from step 1 and buckling pattern from step 2 to obtain analytically the maximum strains in interconnect bridges and device islands. This method is useful to the design and optimization of curvilinear electronics against mechanical and electrical failure.

UR - http://www.scopus.com/inward/record.url?scp=78149266147&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78149266147&partnerID=8YFLogxK

U2 - 10.1039/c0sm00579g

DO - 10.1039/c0sm00579g

M3 - Article

VL - 6

SP - 5757

EP - 5763

JO - Soft Matter

JF - Soft Matter

SN - 1744-683X

IS - 22

ER -

Wang S, Xiao J, Song J, Ko HC, Hwang KC, Huang Y et al. Mechanics of curvilinear electronics. Soft Matter. 2010 Nov 21;6(22):5757-5763. https://doi.org/10.1039/c0sm00579g