Mechanics of curvilinear electronics

Shuodao Wang, Jianliang Xiao, Jizhou Song, Heung Cho Ko, Keh Chih Hwang, Yonggang Huang*, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticle

44 Scopus citations

Abstract

Advanced methods are now available for conformally wrapping planar, silicon-based electronics circuits onto complex, curvilinear surfaces. Here, buckling physics of circuits configured into mesh geometries consisting of silicon islands interconnected by narrow ribbons leads to out of plane displacements across different parts of the curvilinear surface, in a way that accommodates strains associated with wrapping. The mechanisms for different buckling patterns are identified in this paper. A simple and robust method is established via the following steps to predict the buckling patterns of interconnect bridges for arbitrarily axisymmetric curvilinear surfaces: step 1, obtain analytically the strain distribution on the curvilinear surface; step 2, use the strain distribution from step 1 to determine the buckling patterns of interconnect bridges along different directions and at different locations on the curvilinear surface; and step 3, use the strain distribution from step 1 and buckling pattern from step 2 to obtain analytically the maximum strains in interconnect bridges and device islands. This method is useful to the design and optimization of curvilinear electronics against mechanical and electrical failure.

Original languageEnglish (US)
Pages (from-to)5757-5763
Number of pages7
JournalSoft Matter
Volume6
Issue number22
DOIs
StatePublished - Nov 21 2010

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics

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    Wang, S., Xiao, J., Song, J., Ko, H. C., Hwang, K. C., Huang, Y., & Rogers, J. A. (2010). Mechanics of curvilinear electronics. Soft Matter, 6(22), 5757-5763. https://doi.org/10.1039/c0sm00579g