Mechanics of finger-tip electronics

Yewang Su, Rui Li, Huanyu Cheng, Ming Ying, Andrew P. Bonifas, Keh Chih Hwang, John A. Rogers*, Yonggang Huang

*Corresponding author for this work

Research output: Contribution to journalArticle

17 Scopus citations

Abstract

Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.

Original languageEnglish (US)
Article number164511
JournalJournal of Applied Physics
Volume114
Issue number16
DOIs
StatePublished - Oct 28 2013

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'Mechanics of finger-tip electronics'. Together they form a unique fingerprint.

  • Cite this

    Su, Y., Li, R., Cheng, H., Ying, M., Bonifas, A. P., Hwang, K. C., Rogers, J. A., & Huang, Y. (2013). Mechanics of finger-tip electronics. Journal of Applied Physics, 114(16), [164511]. https://doi.org/10.1063/1.4828476