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Mechanics of Smart-Cut® technology
Xi Qiao Feng
*
,
Y. Huang
*
Corresponding author for this work
Civil and Environmental Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
65
Scopus citations
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Physics
Advanced Technology
14%
Crystal Structure
14%
Diffusivity
14%
Failure
14%
Flaking
14%
Fracture Mechanics
14%
Hydrogen
57%
Independent Variables
14%
Insulators
85%
Ion
28%
Ion Implantation
14%
Mechanics
100%
Model
28%
Parameter
14%
Physics
14%
Quality
14%
Silicon
100%
Substrates
14%
Technology
100%
Temperature
14%
Utilization
14%
Wafer
71%
INIS
accounting
28%
applications
14%
comparative evaluations
14%
crack propagation
14%
crystal structure
14%
defects
28%
density
14%
devices
14%
diffusion
14%
doses
42%
embrittlement
14%
failures
14%
fracture mechanics
14%
hydrogen
14%
hydrogen ions
42%
industry
14%
ion implantation
14%
manufacturing
14%
mechanics
100%
microelectronics
14%
nucleation
14%
physics
14%
processing
14%
production
14%
silicon
100%
substrates
14%
thickness
14%
Engineering
Applications
16%
Continuum Mechanic Theory
16%
Conventional Technique
16%
Crystal Structure
16%
Defect Density
16%
Defects
16%
Device Structure
16%
Diffusion
16%
Experimental Observation
16%
Failure (Mechanical)
16%
Fracture Mechanics
16%
High Quality
16%
Implantation
50%
Industrial Production
16%
Mechanisms
33%
Models
33%
Process Parameter
33%
Requirements
16%
Substrates
16%
Temperature
16%
Thickness
16%
ULSI Circuits
16%
Material Science
Blistering
16%
Continuum Mechanics
16%
Crack Propagation
16%
Crystal Structure
16%
Defect Density
16%
Device Integration
16%
Embrittlement
16%
Fracture Mechanics
16%
Ion Implantation
16%
Microelectronics
16%
Nucleation
16%
Paper
16%
Silicon
16%
Silicon on Insulator
100%
Temperature
16%