Mechanics of stretchable electronics

Yihui Zhang*, Keh Chih Hwang, Yonggang Huang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations


Recent advances in mechanics and materials provide routes to integrated circuits that offer the electrical properties of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent and deformed into arbitrary, curvilinear shapes. This paper summarizes developments in this emerging field, with descriptions of application opportunities, fundamental aspects, representative devices, and particularly the effect of plastic deformation.

Original languageEnglish (US)
Title of host publicationAdvances in Engineering Plasticity XI
PublisherTrans Tech Publications Ltd
Number of pages7
ISBN (Print)9783037855485
StatePublished - Jan 1 2013
Event11th Asia-Pacific Conference on Engineering Plasticity and Its Applications, AEPA 2012 - Singapore, Singapore
Duration: Dec 5 2012Dec 7 2012

Publication series

NameKey Engineering Materials
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795


Other11th Asia-Pacific Conference on Engineering Plasticity and Its Applications, AEPA 2012


  • Plastic deformation
  • Stretchability
  • Stretchable and flexible electronics

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Mechanics of stretchable electronics'. Together they form a unique fingerprint.

  • Cite this

    Zhang, Y., Hwang, K. C., & Huang, Y. (2013). Mechanics of stretchable electronics. In Advances in Engineering Plasticity XI (pp. 25-31). (Key Engineering Materials; Vol. 535-536). Trans Tech Publications Ltd.