TY - GEN
T1 - Mechanics of stretchable electronics
AU - Zhang, Yihui
AU - Hwang, Keh Chih
AU - Huang, Yonggang
N1 - Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - Recent advances in mechanics and materials provide routes to integrated circuits that offer the electrical properties of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent and deformed into arbitrary, curvilinear shapes. This paper summarizes developments in this emerging field, with descriptions of application opportunities, fundamental aspects, representative devices, and particularly the effect of plastic deformation.
AB - Recent advances in mechanics and materials provide routes to integrated circuits that offer the electrical properties of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent and deformed into arbitrary, curvilinear shapes. This paper summarizes developments in this emerging field, with descriptions of application opportunities, fundamental aspects, representative devices, and particularly the effect of plastic deformation.
KW - Plastic deformation
KW - Stretchability
KW - Stretchable and flexible electronics
UR - http://www.scopus.com/inward/record.url?scp=84873300216&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84873300216&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.535-536.25
DO - 10.4028/www.scientific.net/KEM.535-536.25
M3 - Conference contribution
AN - SCOPUS:84873300216
SN - 9783037855485
T3 - Key Engineering Materials
SP - 25
EP - 31
BT - Advances in Engineering Plasticity XI
PB - Trans Tech Publications Ltd
T2 - 11th Asia-Pacific Conference on Engineering Plasticity and Its Applications, AEPA 2012
Y2 - 5 December 2012 through 7 December 2012
ER -