Mechanics of stretchable electronics with high fill factors

Yewang Su, Zhuangjian Liu, Seok Kim, Jian Wu, Yonggang Huang*, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticle

16 Scopus citations

Abstract

Mechanics models are developed for an imbricate scale design for stretchable and flexible electronics to achieve both mechanical stretchability and high fill factors (e.g., full, 100% areal coverage). The critical conditions for self collapse of scales and scale contact give analytically the maximum and minimum widths of scales, which are important to the scale design. The maximum strain in scales is obtained analytically, and has a simple upper bound of 3t scale/(4ρ) in terms of the scale thickness t scale and bending radius ρ.

Original languageEnglish (US)
Pages (from-to)3416-3421
Number of pages6
JournalInternational Journal of Solids and Structures
Volume49
Issue number23-24
DOIs
StatePublished - Nov 15 2012

    Fingerprint

Keywords

  • Biomimetics
  • Self collapse
  • Stretchability and bendability
  • Stretchable electronics
  • Transfer printing

ASJC Scopus subject areas

  • Modeling and Simulation
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Applied Mathematics

Cite this