Mechanics of stretchable electronics with high fill factors

Yewang Su; Zhuangjian Liu; Seok Kim; Jian Wu; Yonggang Huang; John A. Rogers

doi:10.1016/j.ijsolstr.2012.07.024

Mechanics of stretchable electronics with high fill factors

Yewang Su, Zhuangjian Liu, Seok Kim, Jian Wu, Yonggang Huang^*, John A. Rogers

^*Corresponding author for this work

Research output: Contribution to journal › Article

16 Scopus citations

Abstract

Mechanics models are developed for an imbricate scale design for stretchable and flexible electronics to achieve both mechanical stretchability and high fill factors (e.g., full, 100% areal coverage). The critical conditions for self collapse of scales and scale contact give analytically the maximum and minimum widths of scales, which are important to the scale design. The maximum strain in scales is obtained analytically, and has a simple upper bound of 3t _scale/(4ρ) in terms of the scale thickness t _scale and bending radius ρ.

Original language	English (US)
Pages (from-to)	3416-3421
Number of pages	6
Journal	International Journal of Solids and Structures
Volume	49
Issue number	23-24
DOIs	https://doi.org/10.1016/j.ijsolstr.2012.07.024
State	Published - Nov 15 2012

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Keywords

Biomimetics
Self collapse
Stretchability and bendability
Stretchable electronics
Transfer printing

ASJC Scopus subject areas

Modeling and Simulation
Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Applied Mathematics

Cite this

Su, Y., Liu, Z., Kim, S., Wu, J., Huang, Y., & Rogers, J. A. (2012). Mechanics of stretchable electronics with high fill factors. International Journal of Solids and Structures, 49(23-24), 3416-3421. https://doi.org/10.1016/j.ijsolstr.2012.07.024

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AU - Rogers, John A.

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Access to Document

10.1016/j.ijsolstr.2012.07.024