Abstract
Mechanics models are developed for an imbricate scale design for stretchable and flexible electronics to achieve both mechanical stretchability and high fill factors (e.g., full, 100% areal coverage). The critical conditions for self collapse of scales and scale contact give analytically the maximum and minimum widths of scales, which are important to the scale design. The maximum strain in scales is obtained analytically, and has a simple upper bound of 3t scale/(4ρ) in terms of the scale thickness t scale and bending radius ρ.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 3416-3421 |
| Number of pages | 6 |
| Journal | International Journal of Solids and Structures |
| Volume | 49 |
| Issue number | 23-24 |
| DOIs | |
| State | Published - Nov 15 2012 |
Keywords
- Biomimetics
- Self collapse
- Stretchability and bendability
- Stretchable electronics
- Transfer printing
ASJC Scopus subject areas
- Modeling and Simulation
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Applied Mathematics
Fingerprint Dive into the research topics of 'Mechanics of stretchable electronics with high fill factors'. Together they form a unique fingerprint.
Cite this
Su, Y., Liu, Z., Kim, S., Wu, J., Huang, Y., & Rogers, J. A. (2012). Mechanics of stretchable electronics with high fill factors. International Journal of Solids and Structures, 49(23-24), 3416-3421. https://doi.org/10.1016/j.ijsolstr.2012.07.024