MECHANISM OF BOND AND SLIP.

Da Hua Jiang*, Surendra P. Shah

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish (US)
Title of host publicationUnknown Host Publication Title
PublisherASCE
Pages1416-1419
Number of pages4
Volume2
ISBN (Print)0872624072
StatePublished - Jan 1 1984

ASJC Scopus subject areas

  • Engineering(all)

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