Keyphrases
Al Cathode
16%
Capping Agent
16%
Capping Material
16%
Cathode Material
16%
Charge Migration
100%
Chemical Stability
33%
Conformal Coverage
16%
Conformal Layer
33%
Cost-benefit
16%
Device Arrays
16%
Device Fabrication
16%
Device Performance
16%
Device Stability
16%
Display Applications
33%
Driving Voltage
16%
Electrical Stability
33%
Electroluminescent Devices
16%
Electron Transfer
16%
Electron Transport
16%
Emission Spectrum
33%
Emissive Layer
33%
External Quantum Efficiency
16%
Fabrication Cost
16%
Flat Panel Display
16%
Glass Substrate
16%
Heterojunction Device
16%
High-resolution Displays
16%
Highlight Generation
33%
Hole Transport Layer
33%
Improved Device
16%
Interlayer Diffusion
16%
ITO Glass
16%
Large Viewing Angle
16%
Layer Deposition
16%
Layer Thickness
16%
Light Collection
16%
Light Emission
100%
Light Output
16%
Light-emitting Diode Device
16%
Low Driving Voltage
33%
Luminescent Efficiency
16%
Luminous Efficiency
16%
Material Interfaces
16%
Mechanical Stability
50%
Microfabrication
16%
Molecular Components
100%
Multilayer Heterojunction
16%
Multilayer Structure
16%
Nanometer Scale
16%
Organic Light-emitting Diodes
100%
Patterned ITO
16%
Performance Metrics
16%
Pinhole
16%
Pixel Array
16%
Polymer Molecules
16%
Polymer-based
16%
Power Generation Efficiency
33%
Self-assembling
16%
Self-assembly Method
33%
Simple Device
16%
Small Molecules
33%
Spin Coating Technique
16%
Supramolecular Self-assembly
33%
Thermal Stability
16%
Thickness Control
16%
Vapor Deposition
33%
Wavelength Control
33%
Engineering
Capping Material
16%
Coating Technique
16%
Device Performance
16%
Emission Wavelength
33%
Emissive Layer
33%
External Quantum Efficiency
16%
Flat Panel Display
16%
Glass Substrate
16%
Heterojunctions
16%
High Resolution
16%
Highlight
33%
Interlayer
16%
Laminate
16%
Layer Thickness
16%
Light Collection
16%
Light Emission
100%
Light Generation
33%
Light Output
16%
Luminous Efficiency
16%
Material Interface
16%
Mechanical Stability
16%
Metrics
16%
Microfabrication
16%
Nanometre
16%
Organic Light-Emitting Diode
100%
Self-Assembly Technique
33%
Thin Layer
16%
Vapor Deposition
33%
Voltage Driving
50%
Material Science
Anode
33%
Cathode
16%
Cathode Material
16%
Device Fabrication
16%
Electron Transfer
33%
Heterojunction
16%
ITO Glass
16%
Laminate
16%
Light-Emitting Diode
100%
Mechanical Stability
16%
Microfabrication
16%
Self Assembly
33%
Silicon
100%
Spin Coating
16%
Thermal Stability
16%