TY - JOUR
T1 - Micro electromechanical systems (MEMS)
T2 - Technology and future applications in circuits
AU - Liu, Chang
PY - 1998/12/1
Y1 - 1998/12/1
N2 - MEMS technology can enable new circuit components. Current examples include RF signal switches, tunable capacitors and inductors, resonant filters, antennas, and relays. These components, all involving micromechanical principles, can provide enhanced performances and reconfigurability, reduced component sizes, and potentially simplified system-level design. I will discuss our DARPA-funded efforts in developing electromechanical RF switches, high-gain antennas, and new types of planar waveguides. Thermal-mechanical RF switches exhibit low on-state insertion loss and high off-state isolation compared with conventional transistor-based counterparts, while operating under IC-compatible bias conditions.
AB - MEMS technology can enable new circuit components. Current examples include RF signal switches, tunable capacitors and inductors, resonant filters, antennas, and relays. These components, all involving micromechanical principles, can provide enhanced performances and reconfigurability, reduced component sizes, and potentially simplified system-level design. I will discuss our DARPA-funded efforts in developing electromechanical RF switches, high-gain antennas, and new types of planar waveguides. Thermal-mechanical RF switches exhibit low on-state insertion loss and high off-state isolation compared with conventional transistor-based counterparts, while operating under IC-compatible bias conditions.
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M3 - Article
AN - SCOPUS:0032226837
SP - 928
EP - 931
JO - International Conference on Solid-State and Integrated Circuit Technology Proceedings
JF - International Conference on Solid-State and Integrated Circuit Technology Proceedings
ER -