MEMS technology can enable new circuit components. Current examples include RF signal switches, tunable capacitors and inductors, resonant filters, antennas, and relays. These components, all involving micromechanical principles, can provide enhanced performances and reconfigurability, reduced component sizes, and potentially simplified system-level design. I will discuss our DARPA-funded efforts in developing electromechanical RF switches, high-gain antennas, and new types of planar waveguides. Thermal-mechanical RF switches exhibit low on-state insertion loss and high off-state isolation compared with conventional transistor-based counterparts, while operating under IC-compatible bias conditions.
|Original language||English (US)|
|Number of pages||4|
|Journal||International Conference on Solid-State and Integrated Circuit Technology Proceedings|
|State||Published - Dec 1 1998|
ASJC Scopus subject areas