Micro thermal shear stress sensor with and without cavity underneath

Jin Biao Huang*, Chih Ming Ho, Steve Tung, Chang Liu, Yu Chong Tai

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

27 Scopus citations

Abstract

Micro hot-film shear-stress sensors have been designed and fabricated by surface micromachining technology compatible with IC technology. A poly-silicon strip, 2μm×80μm, is deposited on the top of a thin silicon nitride film and functions as the sensor element. By using sacrificial-layer technique, a cavity (vacuum chamber), 200×200×2μm3, is placed between the silicon nitride film and silicon substrate. This cavity significantly decreases the heat loss to the substrate. For comparison purposes, a sensor structure without a cavity has also been designed and fabricated on the same chip. Theoretical analyses for the two vertical structures with and without a cavity show that the former has a lower frequency response and higher sensitivity than the latter. When the sensor is operated in constant temperature mode, the cut-off frequencies can reach 130 k-Hz and 9 k-Hz respectively for the sensors without and with cavities.

Original languageEnglish (US)
Title of host publicationConference Record - IEEE Instrumentation and Measurement Technology Conference
PublisherIEEE
Pages171-174
Number of pages4
StatePublished - Jan 1 1995
EventProceedings of the 1995 IEEE Instrumentation and Measurement Technology Conference - Naltham, MA, USA
Duration: Apr 23 1995Apr 26 1995

Other

OtherProceedings of the 1995 IEEE Instrumentation and Measurement Technology Conference
CityNaltham, MA, USA
Period4/23/954/26/95

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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