Abstract
In this paper, we present results on the development of an anisotropic crystalline etching simulation (ACES) program based on a continuous cellular automata (CA) model. The program provides improved spatial resolution and accuracy compared with the conventional and stochastic CA methods. Implementation of a three-dimensional (3-D) dynamic CA technique provides increased simulation speed and reduced memory requirement. The first ACES software based on common personal computer platforms has been realized for simulation of micromachining processes and visualizing results in 3-D space. The software is uniquely capable of simulating the resultant profile following a series of micromachining steps, including surface passivation, reactive ion etching, as well as wet chemical bulk etching. A novel method for accurately obtaining the etch-rate diagram of anisotropic etching using both experimental and numerical techniques has been developed.
Original language | English (US) |
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Pages (from-to) | 252-261 |
Number of pages | 10 |
Journal | Journal of Microelectromechanical Systems |
Volume | 9 |
Issue number | 2 |
DOIs | |
State | Published - Jun 2000 |
Funding
Manuscript received August 4, 1999; revised January 4, 2000. This work was supported by Defence Advanced Research Projects Agency Composite CAD Program under Contract F30602-97-2-0328. Subject Editor, S. D. Senturia. Z. Zhu is with the Micro Actuators, Sensors, and Systems Group, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA. C. Liu is with the Microelectronics Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA (e-mail: [email protected]). Publisher Item Identifier S 1057-7157(00)04857-5.
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering