Micromechanics and advanced designs for curved photodetector arrays in hemispherical electronic-eye cameras

Gunchul Shin, Inhwa Jung, Viktor Malyarchuk, Jizhou Song, Shuodao Wang, Heung Cho Ko, Yonggang Huang, Jeong Sook Ha, John A. Rogers

Research output: Contribution to journalArticle

75 Citations (Scopus)

Abstract

The fabrication of a hemispherical electronic-eye camera with optimized designs based upon micromechanical analysis is reported. The photodetector arrays combine layouts with multidevice tiles and extended, non-coplanar interconnects to improve the fill factor and deformability, respectively. Quantitative comparison to micromechanics analysis reveals the key features of these designs. Color images collected with working cameras demonstrate the utility of these approaches.

Original languageEnglish (US)
Pages (from-to)851-856
Number of pages6
JournalSmall
Volume6
Issue number7
DOIs
StatePublished - Apr 9 2010

Fingerprint

Micromechanics
Photodetectors
Color
Cameras
Formability
Tile
Fabrication

Keywords

  • Compressible electronics
  • Elastomeric transfer
  • Electronic eye cameras
  • Micromechanics
  • Silicon membranes

ASJC Scopus subject areas

  • Biomaterials
  • Engineering (miscellaneous)
  • Biotechnology
  • Medicine(all)

Cite this

Shin, Gunchul ; Jung, Inhwa ; Malyarchuk, Viktor ; Song, Jizhou ; Wang, Shuodao ; Ko, Heung Cho ; Huang, Yonggang ; Ha, Jeong Sook ; Rogers, John A. / Micromechanics and advanced designs for curved photodetector arrays in hemispherical electronic-eye cameras. In: Small. 2010 ; Vol. 6, No. 7. pp. 851-856.
@article{c4da76ac1ac9495f89f63edd0ae7ae8d,
title = "Micromechanics and advanced designs for curved photodetector arrays in hemispherical electronic-eye cameras",
abstract = "The fabrication of a hemispherical electronic-eye camera with optimized designs based upon micromechanical analysis is reported. The photodetector arrays combine layouts with multidevice tiles and extended, non-coplanar interconnects to improve the fill factor and deformability, respectively. Quantitative comparison to micromechanics analysis reveals the key features of these designs. Color images collected with working cameras demonstrate the utility of these approaches.",
keywords = "Compressible electronics, Elastomeric transfer, Electronic eye cameras, Micromechanics, Silicon membranes",
author = "Gunchul Shin and Inhwa Jung and Viktor Malyarchuk and Jizhou Song and Shuodao Wang and Ko, {Heung Cho} and Yonggang Huang and Ha, {Jeong Sook} and Rogers, {John A.}",
year = "2010",
month = "4",
day = "9",
doi = "10.1002/smll.200901350",
language = "English (US)",
volume = "6",
pages = "851--856",
journal = "Small",
issn = "1613-6810",
publisher = "Wiley-VCH Verlag",
number = "7",

}

Micromechanics and advanced designs for curved photodetector arrays in hemispherical electronic-eye cameras. / Shin, Gunchul; Jung, Inhwa; Malyarchuk, Viktor; Song, Jizhou; Wang, Shuodao; Ko, Heung Cho; Huang, Yonggang; Ha, Jeong Sook; Rogers, John A.

In: Small, Vol. 6, No. 7, 09.04.2010, p. 851-856.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Micromechanics and advanced designs for curved photodetector arrays in hemispherical electronic-eye cameras

AU - Shin, Gunchul

AU - Jung, Inhwa

AU - Malyarchuk, Viktor

AU - Song, Jizhou

AU - Wang, Shuodao

AU - Ko, Heung Cho

AU - Huang, Yonggang

AU - Ha, Jeong Sook

AU - Rogers, John A.

PY - 2010/4/9

Y1 - 2010/4/9

N2 - The fabrication of a hemispherical electronic-eye camera with optimized designs based upon micromechanical analysis is reported. The photodetector arrays combine layouts with multidevice tiles and extended, non-coplanar interconnects to improve the fill factor and deformability, respectively. Quantitative comparison to micromechanics analysis reveals the key features of these designs. Color images collected with working cameras demonstrate the utility of these approaches.

AB - The fabrication of a hemispherical electronic-eye camera with optimized designs based upon micromechanical analysis is reported. The photodetector arrays combine layouts with multidevice tiles and extended, non-coplanar interconnects to improve the fill factor and deformability, respectively. Quantitative comparison to micromechanics analysis reveals the key features of these designs. Color images collected with working cameras demonstrate the utility of these approaches.

KW - Compressible electronics

KW - Elastomeric transfer

KW - Electronic eye cameras

KW - Micromechanics

KW - Silicon membranes

UR - http://www.scopus.com/inward/record.url?scp=77950601019&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77950601019&partnerID=8YFLogxK

U2 - 10.1002/smll.200901350

DO - 10.1002/smll.200901350

M3 - Article

VL - 6

SP - 851

EP - 856

JO - Small

JF - Small

SN - 1613-6810

IS - 7

ER -