Microstructural characterization of interface-engineered Si3N4 for improved fracture toughness and wear resistance

G. Ghosh; S. Vaynman; M. E. Fine

Microstructural characterization of interface-engineered Si₃N₄ for improved fracture toughness and wear resistance

G. Ghosh^*, S. Vaynman, M. E. Fine

^*Corresponding author for this work

Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Due to its low density, high strength and high modulus, Si₃N₄ is a potential candidate as a wear resistant material. However, the fracture toughness of Si₃N₄ is rather poor. It is well known that the fracture toughness of ceramics can be increased by introducing compressive residual stress at the surface. Improvement of wear resistance of Si₃N₄ by surface modification with Al₂O₃ has been demonstrated. The strengthening of polycrystalline Si₃N₄ by producing compressive stresses at all grain boundaries throughout the sample was studied.

Original language	English (US)
Title of host publication	Proceedings - Annual Meeting, Microscopy Society of America
Editors	G.W. Bailey, A.J. Garratt-Reed
Pages	624-625
Number of pages	2
State	Published - Dec 1 1994
Event	Proceedings of the 52nd Annual Meeting of the Microscopy Society of America - New Orleans, LA, USA Duration: Jul 31 1994 → Aug 5 1994

Other

Other	Proceedings of the 52nd Annual Meeting of the Microscopy Society of America
City	New Orleans, LA, USA
Period	7/31/94 → 8/5/94

ASJC Scopus subject areas

Engineering(all)

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title = "Microstructural characterization of interface-engineered Si3N4 for improved fracture toughness and wear resistance",

abstract = "Due to its low density, high strength and high modulus, Si3N4 is a potential candidate as a wear resistant material. However, the fracture toughness of Si3N4 is rather poor. It is well known that the fracture toughness of ceramics can be increased by introducing compressive residual stress at the surface. Improvement of wear resistance of Si3N4 by surface modification with Al2O3 has been demonstrated. The strengthening of polycrystalline Si3N4 by producing compressive stresses at all grain boundaries throughout the sample was studied.",

author = "G. Ghosh and S. Vaynman and Fine, {M. E.}",

year = "1994",

month = dec,

day = "1",

language = "English (US)",

pages = "624--625",

editor = "G.W. Bailey and A.J. Garratt-Reed",

booktitle = "Proceedings - Annual Meeting, Microscopy Society of America",

note = "Proceedings of the 52nd Annual Meeting of the Microscopy Society of America ; Conference date: 31-07-1994 Through 05-08-1994",

}

Ghosh, G, Vaynman, S & Fine, ME 1994, Microstructural characterization of interface-engineered Si₃N₄ for improved fracture toughness and wear resistance. in GW Bailey & AJ Garratt-Reed (eds), Proceedings - Annual Meeting, Microscopy Society of America. pp. 624-625, Proceedings of the 52nd Annual Meeting of the Microscopy Society of America, New Orleans, LA, USA, 7/31/94.

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AU - Vaynman, S.

AU - Fine, M. E.

PY - 1994/12/1

Y1 - 1994/12/1

N2 - Due to its low density, high strength and high modulus, Si3N4 is a potential candidate as a wear resistant material. However, the fracture toughness of Si3N4 is rather poor. It is well known that the fracture toughness of ceramics can be increased by introducing compressive residual stress at the surface. Improvement of wear resistance of Si3N4 by surface modification with Al2O3 has been demonstrated. The strengthening of polycrystalline Si3N4 by producing compressive stresses at all grain boundaries throughout the sample was studied.

AB - Due to its low density, high strength and high modulus, Si3N4 is a potential candidate as a wear resistant material. However, the fracture toughness of Si3N4 is rather poor. It is well known that the fracture toughness of ceramics can be increased by introducing compressive residual stress at the surface. Improvement of wear resistance of Si3N4 by surface modification with Al2O3 has been demonstrated. The strengthening of polycrystalline Si3N4 by producing compressive stresses at all grain boundaries throughout the sample was studied.

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BT - Proceedings - Annual Meeting, Microscopy Society of America

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