Microstructural stability during cyclic loading of multilayer copper/copper samples with nanoscale twinning

C. J. Shute, B. D. Myers, S. Xie, T. W. Barbee, A. M. Hodge, J. R. Weertman*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

62 Scopus citations

Abstract

The response to cyclic deformation has been studied for Cu/Cu multilayer material consisting of columns of closely spaced, parallel nanotwins. The fatigue life under stress-controlled cycling is greatly improved over that of coarse-grained Cu. Nanotwinning provides significant strengthening, which is unchanged by fatigue or severe compression. Observations by focused ion beam microscopy showed that the microstructure is quite stable under deformation. Localized deformation from indentation produced shear bands and apparently some loss of nanotwinned area but no decrease in hardness.

Original languageEnglish (US)
Pages (from-to)1073-1077
Number of pages5
JournalScripta Materialia
Volume60
Issue number12
DOIs
StatePublished - Jun 2009

Keywords

  • Copper
  • FIB
  • Fatigue test
  • Nanostructured materials
  • Twinning

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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