Abstract
A method, combining micro-contact printing (μCP), wet chemical etching and reactive ion etching (RIE), is reported to fabricate microstructures on Si and SiOx. Positive and negative structures were generated based on different stamps used for μCP. The reproducibility of the obtained microstructures shows the methodology reported herein could be useful in Micro-Electro-Mechanical Systems (MEMS), optical and biological sensing applications.
Original language | English (US) |
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Pages (from-to) | 1960-1963 |
Number of pages | 4 |
Journal | Applied Surface Science |
Volume | 253 |
Issue number | 4 |
DOIs | |
State | Published - Dec 15 2006 |
Externally published | Yes |
Keywords
- Micro-contact printing
- Reactive ion etching
- Silicon
- Silicon oxide
- Wet chemical etching
ASJC Scopus subject areas
- Chemistry(all)
- Condensed Matter Physics
- Physics and Astronomy(all)
- Surfaces and Interfaces
- Surfaces, Coatings and Films