Skip to main navigation
Skip to search
Skip to main content
Northwestern Scholars Home
Help & FAQ
Home
Experts
Organizations
Research Output
Grants
Core Facilities
Research Data
Search by expertise, name or affiliation
Microstructure development during pack aluminization of nickel and nickel-chromium wires
Dinc Erdeniz
*
,
David C. Dunand
*
Corresponding author for this work
Materials Science and Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
25
Scopus citations
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Microstructure development during pack aluminization of nickel and nickel-chromium wires'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Keyphrases
NiCrBSi
100%
Intermetallics
100%
Pack Aluminizing
100%
Microstructure Development
100%
Nickel-chromium Alloy
100%
Aging
50%
Precipitation Strengthening
50%
Ni Wire
50%
Interdiffusion
50%
Ni-based Superalloy
50%
High Hardness
50%
Protective Coatings
50%
NiAl
50%
Growth Kinetics
50%
Ni3Al
50%
Chemical Vapor Deposition Processes
50%
Silicide
50%
Ni-rich
50%
Additional Phase
50%
Aluminizing
50%
Aluminization
50%
Al Wire
50%
Material Science
Nichrome
100%
Intermetallics
100%
Nickel-Based Superalloys
50%
Silicide
50%
Vapor Phase Deposition
50%
Chemical Vapor Deposition
50%
Surface (Surface Science)
50%
Protective Coating
50%