Microstructure of Conductive Anodic Filaments Formed during Accelerated Testing of Printed Wiring Boards

W. J. Ready, S. R. Stock, L. J. Turbini, L. L. Dollar, G. B. Freeman

Research output: Contribution to journalReview article

13 Citations (Scopus)

Abstract

Under certain environmental conditions, printed wiring boards (PWBs) respond to applied voltages by developing sub-surface deposits of copper salts extending from anode to cathode along separated fibre/epoxy interfaces. These deposits are termed conductive anodic filaments (CAFs) and, in this work, the dimensions and growth patterns of a CAF have been determined by serial sectioning. The CAF growth pathway is characterised and the spatial distribution of the copper salts is quantified with scanning electron microscopy (SEM) using backscattered electrons. The chemical composition of the CAF is determined using energy dispersive X-ray analysis (EDS). Prior research using high-resolution non-destructive X-ray microtomography is correlated with the serial sectioning data. The failure phenomenon known as CAF may pose serious long-term reliability concerns in electronics applications exposed to adverse and hostile environments.

Original languageEnglish (US)
Pages (from-to)5-9
Number of pages5
JournalCircuit World
Volume21
Issue number4
DOIs
StatePublished - Apr 1 1995

Fingerprint

Printed circuit boards
Deposits
Salts
Copper
Microstructure
Energy dispersive X ray analysis
Testing
Spatial distribution
Energy dispersive spectroscopy
Anodes
Cathodes
Electronic equipment
X rays
Scanning electron microscopy
Electrons
Fibers
Electric potential
Chemical analysis

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Ready, W. J. ; Stock, S. R. ; Turbini, L. J. ; Dollar, L. L. ; Freeman, G. B. / Microstructure of Conductive Anodic Filaments Formed during Accelerated Testing of Printed Wiring Boards. In: Circuit World. 1995 ; Vol. 21, No. 4. pp. 5-9.
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Microstructure of Conductive Anodic Filaments Formed during Accelerated Testing of Printed Wiring Boards. / Ready, W. J.; Stock, S. R.; Turbini, L. J.; Dollar, L. L.; Freeman, G. B.

In: Circuit World, Vol. 21, No. 4, 01.04.1995, p. 5-9.

Research output: Contribution to journalReview article

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