Microstructure of Cu-C interface in Cu-based metal matrix composite

A. Berner*, K. C. Mundim, D. E. Ellis, S. Dorfman, D. Fuks, R. Evenhaim

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

38 Scopus citations

Abstract

Existence of dilute copper-carbon solid solutions is one of the characteristic features of the interfaces of the metal matrix composites widely used in the electrical applications. Experimental high-resolution SEM study allows to visualize the formation of the interaction zone on carbon fibre. We model interstitial solid solutions formed in this interaction zone non-empirically within the embedded-cluster and supercell approaches. Atomistic approach allows selection of the geometry of the solid solution. Electronic structure studies show that the most favourable position of the carbon atom is shifted along the [110] direction from the centre of the octahedral position. Investigation of this physical phenomenon allows us to understand the nature of the chemical bonding in copper-based solid solutions with carbon.

Original languageEnglish (US)
Pages (from-to)86-90
Number of pages5
JournalSensors and Actuators, A: Physical
Volume74
Issue number1
DOIs
StatePublished - Apr 20 1999
EventProceedings of the 1998 E-MRS Symposium H: Materials Aspects in Microsystem Technologies - Strasbourg, FRA
Duration: Jun 16 1998Jun 19 1998

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

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