Model of crack nucleation in layered electronic assemblies under thermal cycling

A. Chandra*, Y. Huang, Z. Q. Jiang, K. X. Hu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A model for crack nucleation in layered electronic assemblies under thermal cycling is developed in this paper. The present model includes three scales: (i) at the microscale or the mechanism level, the damage mechanisms such as diffusive void growth or fatigue cracks, determine the damage growth rate; (2) at an intermediate mesoscale, the localized damage bands are modeled as variable stiffness springs connecting undamaged materials; and (iii) at the macroscale or the continuum level, the localized damage band growing in an otherwise undamaged material is modeled as an array of dislocations. The three scales are then combined together to incorporate damage mechanisms into continuum analysis. Traditional fracture mechanics provides a crack propagation model based on pre-existing cracks. The present work provides an approach for predicting crack nucleation. The proposed model is then utilized to investigate crack nucleations in three-layered electronic assemblies under thermal cycling. The damage is observed to accumulate rapidly in the weakest regions of the band. Estimates are obtained for critical time or critical number of cycles at which a macroscopic crack will nucleate in these assemblies under thermal cycling. This critical number of cycles is found to be insensitive to the size of the damage cluster, but decreases rapidly as the local excess damage increases.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, Design Engineering Division (Publication) DE
PublisherASME
Pages139-147
Number of pages9
Volume104
ISBN (Print)0791816532
StatePublished - Dec 1 1999
EventElectronics Manufacturing Isssues - 1999 (The ASME International Mechanical Engineering Congress and Exposition) - Nashville, TN, USA
Duration: Nov 14 1999Nov 19 1999

Other

OtherElectronics Manufacturing Isssues - 1999 (The ASME International Mechanical Engineering Congress and Exposition)
CityNashville, TN, USA
Period11/14/9911/19/99

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Model of crack nucleation in layered electronic assemblies under thermal cycling'. Together they form a unique fingerprint.

  • Cite this

    Chandra, A., Huang, Y., Jiang, Z. Q., & Hu, K. X. (1999). Model of crack nucleation in layered electronic assemblies under thermal cycling. In American Society of Mechanical Engineers, Design Engineering Division (Publication) DE (Vol. 104, pp. 139-147). ASME.