Abstract
Recently, time-of-flight (ToF) sensors have emerged as a promising three-dimensional sensing technology that can be manufactured inexpensively in a compact size. However, current state-of-the-art ToF sensors suffer from low spatial resolution due to physical limitations in the fabrication process. In this paper, we analyze the ToF sensor's output as a complex value coupling the depth and intensity information in a phasor representation. Based on this analysis, we introduce a novel multi-frame superresolution technique that can improve both spatial resolution in intensity and depth images simultaneously. We believe our proposed method can benefit numerous applications where high resolution depth sensing is desirable, such as precision automated navigation and collision avoidance.
Original language | English (US) |
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Title of host publication | 2019 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2019 - Proceedings |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 2327-2331 |
Number of pages | 5 |
ISBN (Electronic) | 9781479981311 |
DOIs | |
State | Published - May 2019 |
Event | 44th IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2019 - Brighton, United Kingdom Duration: May 12 2019 → May 17 2019 |
Publication series
Name | ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings |
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Volume | 2019-May |
ISSN (Print) | 1520-6149 |
Conference
Conference | 44th IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2019 |
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Country/Territory | United Kingdom |
City | Brighton |
Period | 5/12/19 → 5/17/19 |
Funding
This work was supported in part by NSF CAREER grant IIS-1453192, ONR grant N00014-15-1-2735, and DARPA REVEAL grant HR0011-16-C-0028.
Keywords
- Complex Model.
- Multi-frame Superresolution
- Time-of-flight Imaging
ASJC Scopus subject areas
- Software
- Signal Processing
- Electrical and Electronic Engineering