Multi-layer thin films/substrate system subjected to non-uniform misfit strains

X. Feng, Y. Huang*, A. J. Rosakis

*Corresponding author for this work

Research output: Contribution to journalArticle

31 Scopus citations

Abstract

Current methodologies used for the inference of thin film stress through curvature measurement are strictly restricted to stress and curvature states that are assumed to remain uniform over the entire film/substrate system. These methodologies have recently been extended to a single layer of thin film deposited on a substrate subjected to the non-uniform misfit strain in the thin film. Such methodologies are further extended to multi-layer thin films deposited on a substrate in the present study. Each thin film may have its own non-uniform misfit strain. We derive relations between the stresses in each thin film and the change of system curvatures due to the deposition of each thin film. The interface shear stresses between the adjacent films and between the thin film and the substrate are also obtained from the system curvatures. This provides the basis for the experimental determination of thin film stresses in multi-layer thin films on a substrate.

Original languageEnglish (US)
Pages (from-to)3688-3698
Number of pages11
JournalInternational Journal of Solids and Structures
Volume45
Issue number13
DOIs
StatePublished - Jun 30 2008

Keywords

  • Interfacial shears
  • Multi-layer thin films
  • Non-local stress-curvature relations
  • Non-uniform misfit strain
  • Non-uniform wafer curvatures

ASJC Scopus subject areas

  • Modeling and Simulation
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Applied Mathematics

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