Multifunctional Materials Strategies for Enhanced Safety of Wireless, Skin-Interfaced Bioelectronic Devices

Claire Liu, Jin Tae Kim, Da Som Yang, Donghwi Cho, Seonggwang Yoo, Surabhi R. Madhvapathy, Hyoyoung Jeong, Tianyu Yang, Haiwen Luan, Raudel Avila, Jihun Park, Yunyun Wu, Kennedy Bryant, Min Cho, Ji Yong Lee, Jay Young Kwak, Won Hyoung Ryu, Yonggang Huang*, Ralph G. Nuzzo*, John A. Rogers*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Scopus citations


Many recently developed classes of wireless, skin-interfaced bioelectronic devices rely on conventional thermoset silicone elastomer materials, such as poly(dimethylsiloxane) (PDMS), as soft encapsulating structures around collections of electronic components, radio frequency antennas and, commonly, rechargeable batteries. In optimized layouts and device designs, these materials provide attractive features, most prominently in their gentle, noninvasive interfaces to the skin even at regions of high curvature and large natural deformations. Past studies, however, overlook opportunities for developing variants of these materials for multimodal means to enhance the safety of the devices against failure modes that range from mechanical damage to thermal runaway. This study presents a self-healing PDMS dynamic covalent matrix embedded with chemistries that provide thermochromism, mechanochromism, strain-adaptive stiffening, and thermal insulation, as a collection of attributes relevant to safety. Demonstrations of this materials system and associated encapsulation strategy involve a wireless, skin-interfaced device that captures mechanoacoustic signatures of health status. The concepts introduced here can apply immediately to many other related bioelectronic devices.

Original languageEnglish (US)
Article number2302256
JournalAdvanced Functional Materials
Issue number34
StatePublished - Aug 22 2023


  • composite materials
  • safety
  • soft electronics
  • stimuli-responsive
  • wireless wearables

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • General Chemistry
  • Biomaterials
  • General Materials Science
  • Condensed Matter Physics
  • Electrochemistry


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