Multilayer thin films/substrate system with variable film thickness subjected to non-uniform misfit strains

D. Ngo, X. Feng, Yonggang Huang*, A. J. Rosakis

*Corresponding author for this work

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

Current methodologies used to infer thin-film stress from curvature measurements are strictly restricted to stress and curvature states that are assumed to remain uniform over the entire film/substrate system. These methodologies have recently been extended to a single thin film of non-uniform thickness deposited on a substrate and subjected to the non-uniform misfit strain. Such methodologies are extended to multilayer thin films of non-uniform thickness deposited on a substrate in the present study. Each thin film may have its own non-uniform misfit strain and non-uniform thickness. We obtain the film stresses and system curvatures in terms of the misfit strains and thickness in thin films. We derive the film stresses and interface shear stresses in terms of system curvatures and film thicknesses. They all feature a "non-local" dependence on curvatures, which make full-field measurement a necessity for the experimental inference of such stresses.

Original languageEnglish (US)
Pages (from-to)5322-5328
Number of pages7
JournalActa Materialia
Volume56
Issue number18
DOIs
StatePublished - Oct 1 2008

Fingerprint

Multilayer films
Film thickness
Thin films
Substrates
Shear stress

Keywords

  • Islands of films
  • Multilayer thin films
  • Non-local stress-curvature relations
  • Non-uniform film thickness
  • Non-uniform misfit strain

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

Cite this

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abstract = "Current methodologies used to infer thin-film stress from curvature measurements are strictly restricted to stress and curvature states that are assumed to remain uniform over the entire film/substrate system. These methodologies have recently been extended to a single thin film of non-uniform thickness deposited on a substrate and subjected to the non-uniform misfit strain. Such methodologies are extended to multilayer thin films of non-uniform thickness deposited on a substrate in the present study. Each thin film may have its own non-uniform misfit strain and non-uniform thickness. We obtain the film stresses and system curvatures in terms of the misfit strains and thickness in thin films. We derive the film stresses and interface shear stresses in terms of system curvatures and film thicknesses. They all feature a {"}non-local{"} dependence on curvatures, which make full-field measurement a necessity for the experimental inference of such stresses.",
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Multilayer thin films/substrate system with variable film thickness subjected to non-uniform misfit strains. / Ngo, D.; Feng, X.; Huang, Yonggang; Rosakis, A. J.

In: Acta Materialia, Vol. 56, No. 18, 01.10.2008, p. 5322-5328.

Research output: Contribution to journalArticle

TY - JOUR

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