Nanoscale elastic imaging of aluminum/low-k dielectric interconnect structures

Keyphrases

• Nanometer Scale 100%
• Interconnected Structure 100%
• Integrated Circuit Testing 100%
• Elasticity Imaging 100%
• Low-k Dielectric 100%
• Material Mechanical Properties 50%
• Spatial Resolution 50%
• Mechanical Properties 50%
• Process Integration 50%
• Characterization Tools 50%
• New Characterization 50%
• Integrated Circuits 50%
• Elastic Modulus 50%
• Reactive Ion Etching 50%
• Polymer Interface 50%
• Reliability Evaluation 50%
• Damascene 50%
• Ultrasonic Force Microscopy 50%
• Metrological Reliability 50%
• Aluminum Polymer 50%
• Back-end-of-line 50%

Engineering

• Dielectrics 100%
• Interconnects 100%
• Nanoscale 100%
• Integrated Circuit 100%
• Nanometre 66%
• Test Structure 66%
• Circuit Test 66%
• Reactive Ion Etch 33%
• Reliability Evaluation 33%
• Spatial Resolution 33%
• Ultrasonics 33%
• Modulus of Elasticity 33%

Material Science

• Aluminum 100%
• Dielectric Material 100%
• Electronic Circuit 75%
• Elastic Moduli 25%