Nanostructured thermoelectric materials and high-efficiency power-generation modules

Timothy P. Hogan*, Adam Downey, Jarrod Short, Jonathan D'Angelo, Chun I. Wu, Eric Quarez, John Androulakis, Pierre F.P. Poudeu, Joseph R. Sootsman, Duck Young Chung, Mercouri G. Kanatzidis, S. D. Mahanti, Edward J. Timm, Harold Schock, Fei Ren, Jason Johnson, Eldon D. Case

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

54 Scopus citations


For thermoelectric applications, the best materials have high electrical conductivity and thermopower and, simultaneously, low thermal conductivity. Such a combination of properties is usually found in heavily doped semiconductors. Renewed interest in this topic has followed recent theoretical predictions that significant increases in performance are possible for nanostructured materials, and this has been experimentally verified. During exploratory synthetic studies of chalcogenide-based bulk thermoelectric materials it was discovered that several compounds spontaneously formed endotaxially embedded nanostructures. These compounds have some of the best known properties for bulk thermoelectric materials in the 500-800 K temperature range. Here we report our continued efforts to better understand the role of the nanostructures while concurrently furthering the development of these new materials (for example n-type lead-antimony-silver-tellurium, and p-type lead-antimony-silver-tin-tellurium) into thermoelectric power-generation devices.

Original languageEnglish (US)
Pages (from-to)704-710
Number of pages7
JournalJournal of Electronic Materials
Issue number7
StatePublished - Jul 2007


  • Bulk materials
  • Nanostructures
  • Thermoelectrics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry
  • Electrical and Electronic Engineering


Dive into the research topics of 'Nanostructured thermoelectric materials and high-efficiency power-generation modules'. Together they form a unique fingerprint.

Cite this