TY - JOUR
T1 - Near-field ultrasonic imaging
T2 - A novel method for nondestructive mechanical imaging of IC interconnect structures
AU - Shekhawat, G. S.
AU - Xie, H.
AU - Zheng, Y.
AU - Geer, R. E.
PY - 2002
Y1 - 2002
N2 - Tne investigation of an alternate approach to nondestructive, nanoscale mechanical imaging for IC interconnect structures is reported. This approach utilizes a heterodyne interferometer based on a scanning probe microscope, also referred to as heterodyne force microscopy (HFM). This interferometer is sensitive to the relative phase difference of the two ultrasonic excitations due to spatial variations in the sample viscoelastic response and enables near-field, phase-sensitive imaging. Proof-of-feasibility demonstrations of this technique are presented for ultrasonic phase-imaging of Al/low-k interconnect structures. Spatial resolution < 10 nm is demonstrated.
AB - Tne investigation of an alternate approach to nondestructive, nanoscale mechanical imaging for IC interconnect structures is reported. This approach utilizes a heterodyne interferometer based on a scanning probe microscope, also referred to as heterodyne force microscopy (HFM). This interferometer is sensitive to the relative phase difference of the two ultrasonic excitations due to spatial variations in the sample viscoelastic response and enables near-field, phase-sensitive imaging. Proof-of-feasibility demonstrations of this technique are presented for ultrasonic phase-imaging of Al/low-k interconnect structures. Spatial resolution < 10 nm is demonstrated.
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U2 - 10.1557/proc-716-b11.14
DO - 10.1557/proc-716-b11.14
M3 - Article
AN - SCOPUS:0036950540
SN - 0272-9172
VL - 716
SP - 519
EP - 524
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
ER -