New kinetic model for degree of cure and viscosity in liquid molding application

Moon Kwang Um*, Isaac M. Daniel

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

In general, manufacturing processes of thermosetting composites consist of mold filling and resin cure. The important parameters used in modeling and designing mold filling are the permeability of the fibrous preform and the viscosity of the resin. To consolidate a composite, resin cure or chemical reaction plays an essential role. Cure kinetics, therefore, is necessary to quantify the extent of chemical reaction or degree of cure. It is also important to predict resin viscosity which can change due to chemical reaction during mold filling. There exists a heat transfer between the mold and the composite during mold filling and resin cure. Cure kinetics is also used to predict the temperature distribution inside the composite. In this study, a new scheme which can determine cure kinetics from dynamic temperature scaning is proposed. The method was applied to an epoxy resin system and was verified by comparing measurements and predictions. Viscosity was also measured and correlated with the extent of chemical reaction and temperature.

Original languageEnglish (US)
JournalInternational SAMPE Symposium and Exhibition (Proceedings)
Volume45
StatePublished - Jan 1 2000

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Chemical Engineering (miscellaneous)
  • Building and Construction
  • Polymers and Plastics

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