Noncontact inspection of opaque film thickness in single-layer and multilayer structures and edge-exclusion zones

M. Banet; Martin Fuchs; Randy A. Logan; Keith A. Nelson; John A. Rogers

Noncontact inspection of opaque film thickness in single-layer and multilayer structures and edge-exclusion zones

M. Banet^*, Martin Fuchs, Randy A. Logan, Keith A. Nelson, John A. Rogers

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

A rapid, noncontact, nondestructive optical measurement method permits determination of the thicknesses of opaque films with angstrom repeatability. The method, called impulsive stimulated thermal scattering (ISTS), can be used on nearly any metal including Cu, Al, Tl, W, and Ti:W. Measurements are made across the entire area of a wafer including the edge-exclusion zone, permitting examination of beveled layer edges. Exposed and buried metal layers can both be measured. Typical data acquisition time is about one second, suitable for in-line measurement of product wafers. Comparisons of ISTS results with those of conventional four-point probe, SEM, and profilometry measurements are favorable.

Original language	English (US)
Pages (from-to)	35-37
Number of pages	3
Journal	IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings
State	Published - 1997
Event	Proceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference - San Francisco, CA, USA Duration: Oct 6 1997 → Oct 8 1997

ASJC Scopus subject areas

Engineering(all)

Cite this

@article{670a5cdf9df949af84534d9ee10464c9,

title = "Noncontact inspection of opaque film thickness in single-layer and multilayer structures and edge-exclusion zones",

abstract = "A rapid, noncontact, nondestructive optical measurement method permits determination of the thicknesses of opaque films with angstrom repeatability. The method, called impulsive stimulated thermal scattering (ISTS), can be used on nearly any metal including Cu, Al, Tl, W, and Ti:W. Measurements are made across the entire area of a wafer including the edge-exclusion zone, permitting examination of beveled layer edges. Exposed and buried metal layers can both be measured. Typical data acquisition time is about one second, suitable for in-line measurement of product wafers. Comparisons of ISTS results with those of conventional four-point probe, SEM, and profilometry measurements are favorable.",

author = "M. Banet and Martin Fuchs and Logan, {Randy A.} and Nelson, {Keith A.} and Rogers, {John A.}",

year = "1997",

language = "English (US)",

pages = "35--37",

journal = "ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings",

issn = "1523-553X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference ; Conference date: 06-10-1997 Through 08-10-1997",

}

TY - JOUR

T1 - Noncontact inspection of opaque film thickness in single-layer and multilayer structures and edge-exclusion zones

AU - Banet, M.

AU - Fuchs, Martin

AU - Logan, Randy A.

AU - Nelson, Keith A.

AU - Rogers, John A.

PY - 1997

Y1 - 1997

N2 - A rapid, noncontact, nondestructive optical measurement method permits determination of the thicknesses of opaque films with angstrom repeatability. The method, called impulsive stimulated thermal scattering (ISTS), can be used on nearly any metal including Cu, Al, Tl, W, and Ti:W. Measurements are made across the entire area of a wafer including the edge-exclusion zone, permitting examination of beveled layer edges. Exposed and buried metal layers can both be measured. Typical data acquisition time is about one second, suitable for in-line measurement of product wafers. Comparisons of ISTS results with those of conventional four-point probe, SEM, and profilometry measurements are favorable.

AB - A rapid, noncontact, nondestructive optical measurement method permits determination of the thicknesses of opaque films with angstrom repeatability. The method, called impulsive stimulated thermal scattering (ISTS), can be used on nearly any metal including Cu, Al, Tl, W, and Ti:W. Measurements are made across the entire area of a wafer including the edge-exclusion zone, permitting examination of beveled layer edges. Exposed and buried metal layers can both be measured. Typical data acquisition time is about one second, suitable for in-line measurement of product wafers. Comparisons of ISTS results with those of conventional four-point probe, SEM, and profilometry measurements are favorable.

UR - http://www.scopus.com/inward/record.url?scp=0031349187&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031349187&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0031349187

SN - 1523-553X

SP - 35

EP - 37

JO - ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

JF - ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

T2 - Proceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference

Y2 - 6 October 1997 through 8 October 1997

ER -

Noncontact inspection of opaque film thickness in single-layer and multilayer structures and edge-exclusion zones

Abstract

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this