Noncontact inspection of opaque film thickness in single-layer and multilayer structures and edge-exclusion zones

M. Banet*, Martin Fuchs, Randy A. Logan, Keith A. Nelson, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

A rapid, noncontact, nondestructive optical measurement method permits determination of the thicknesses of opaque films with angstrom repeatability. The method, called impulsive stimulated thermal scattering (ISTS), can be used on nearly any metal including Cu, Al, Tl, W, and Ti:W. Measurements are made across the entire area of a wafer including the edge-exclusion zone, permitting examination of beveled layer edges. Exposed and buried metal layers can both be measured. Typical data acquisition time is about one second, suitable for in-line measurement of product wafers. Comparisons of ISTS results with those of conventional four-point probe, SEM, and profilometry measurements are favorable.

Original languageEnglish (US)
Pages (from-to)35-37
Number of pages3
JournalIEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings
StatePublished - Dec 1 1997
EventProceedings of the 1997 IEEE International Symposium on Semiconductor on Manufacturing Conference - San Francisco, CA, USA
Duration: Oct 6 1997Oct 8 1997

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Noncontact inspection of opaque film thickness in single-layer and multilayer structures and edge-exclusion zones'. Together they form a unique fingerprint.

Cite this