Noninvasive real-time evaluation of the anisotropic thermal diffusivity in thin polymer films for electronics packaging

John A. Rogers; C. Mindas; Y. Yang; K. A. Nelson

Noninvasive real-time evaluation of the anisotropic thermal diffusivity in thin polymer films for electronics packaging

John A. Rogers^*, C. Mindas, Y. Yang, K. A. Nelson

^*Corresponding author for this work

Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Scopus citations

Abstract

We describe an experimental method capable of evaluating the in- and out-of-plane components of the anisotropic thermal diffusivity in supported and unsupported thin polymer films. The technique is used to quantify the in-plane thermal diffusivity in films of PMDA/ODA (Dupont's PI2545), BTDA/ODA/MPD (Dupont's PI2555), BPDA/PPD (Dupont's PI2611), BCB (Dow's Cyclotene 3022) and HFDA-APBP (Amoco's UD4212) with thicknesses in the 1-10 micron range.

Original language	English (US)
Title of host publication	Electronic Packaging Materials Science VII
Editors	Peter Borgesen, Klavs F. Jensen, Roger A. Pollak
Publisher	Publ by Materials Research Society
Pages	441-445
Number of pages	5
Volume	323
ISBN (Print)	1558992227
State	Published - Jan 1 1994
Event	Proceedings of the Fall 1993 MRS Meeting - Boston, MA, USA Duration: Nov 29 1993 → Dec 3 1993

Other

Other	Proceedings of the Fall 1993 MRS Meeting
City	Boston, MA, USA
Period	11/29/93 → 12/3/93

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Cite this

@inproceedings{19ef8c908f7b41b79aabdf8af7a6bb0c,

title = "Noninvasive real-time evaluation of the anisotropic thermal diffusivity in thin polymer films for electronics packaging",

abstract = "We describe an experimental method capable of evaluating the in- and out-of-plane components of the anisotropic thermal diffusivity in supported and unsupported thin polymer films. The technique is used to quantify the in-plane thermal diffusivity in films of PMDA/ODA (Dupont's PI2545), BTDA/ODA/MPD (Dupont's PI2555), BPDA/PPD (Dupont's PI2611), BCB (Dow's Cyclotene 3022) and HFDA-APBP (Amoco's UD4212) with thicknesses in the 1-10 micron range.",

author = "Rogers, {John A.} and C. Mindas and Y. Yang and Nelson, {K. A.}",

year = "1994",

month = jan,

day = "1",

language = "English (US)",

isbn = "1558992227",

volume = "323",

pages = "441--445",

editor = "Peter Borgesen and Jensen, {Klavs F.} and Pollak, {Roger A.}",

booktitle = "Electronic Packaging Materials Science VII",

publisher = "Publ by Materials Research Society",

note = "Proceedings of the Fall 1993 MRS Meeting ; Conference date: 29-11-1993 Through 03-12-1993",

}

Rogers, JA, Mindas, C, Yang, Y & Nelson, KA 1994, Noninvasive real-time evaluation of the anisotropic thermal diffusivity in thin polymer films for electronics packaging. in P Borgesen, KF Jensen & RA Pollak (eds), Electronic Packaging Materials Science VII. vol. 323, Publ by Materials Research Society, pp. 441-445, Proceedings of the Fall 1993 MRS Meeting, Boston, MA, USA, 11/29/93.

Noninvasive real-time evaluation of the anisotropic thermal diffusivity in thin polymer films for electronics packaging. / Rogers, John A.; Mindas, C.; Yang, Y. et al.

Electronic Packaging Materials Science VII. ed. / Peter Borgesen; Klavs F. Jensen; Roger A. Pollak. Vol. 323 Publ by Materials Research Society, 1994. p. 441-445.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Noninvasive real-time evaluation of the anisotropic thermal diffusivity in thin polymer films for electronics packaging

AU - Rogers, John A.

AU - Mindas, C.

AU - Yang, Y.

AU - Nelson, K. A.

PY - 1994/1/1

Y1 - 1994/1/1

N2 - We describe an experimental method capable of evaluating the in- and out-of-plane components of the anisotropic thermal diffusivity in supported and unsupported thin polymer films. The technique is used to quantify the in-plane thermal diffusivity in films of PMDA/ODA (Dupont's PI2545), BTDA/ODA/MPD (Dupont's PI2555), BPDA/PPD (Dupont's PI2611), BCB (Dow's Cyclotene 3022) and HFDA-APBP (Amoco's UD4212) with thicknesses in the 1-10 micron range.

AB - We describe an experimental method capable of evaluating the in- and out-of-plane components of the anisotropic thermal diffusivity in supported and unsupported thin polymer films. The technique is used to quantify the in-plane thermal diffusivity in films of PMDA/ODA (Dupont's PI2545), BTDA/ODA/MPD (Dupont's PI2555), BPDA/PPD (Dupont's PI2611), BCB (Dow's Cyclotene 3022) and HFDA-APBP (Amoco's UD4212) with thicknesses in the 1-10 micron range.

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M3 - Conference contribution

AN - SCOPUS:0027928255

SN - 1558992227

VL - 323

SP - 441

EP - 445

BT - Electronic Packaging Materials Science VII

A2 - Borgesen, Peter

A2 - Jensen, Klavs F.

A2 - Pollak, Roger A.

PB - Publ by Materials Research Society

T2 - Proceedings of the Fall 1993 MRS Meeting

Y2 - 29 November 1993 through 3 December 1993

ER -

Noninvasive real-time evaluation of the anisotropic thermal diffusivity in thin polymer films for electronics packaging

Abstract

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ASJC Scopus subject areas

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