Novel chemical approach to achieve advanced soft lithography by developing new stiffer, photocurable PDMS stamp materials

Kyung M. Choi*, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalConference article

2 Scopus citations

Abstract

Recent advances in microfabrication technology allow us to develop a number of novel devices with high performance. In microfabrication technology, a new development, 'soft lithography', is widely used by making stamps, molding, and microcontact-printing due to the low cost and easy processability. The resolution of soft lithography significantly relies on the performance of stamping materials. However, pattern transfers using commercially available PDMS stamp materials often end up with mechanical failures such as collapse or sag due to their low physical stiffness. Additionally, most of those commercial PDMS materials are thermally curable systems, which results in significant thermal deformations. These limitations have motivated us to start this work, which demonstrates a 'chemical approach' to overcome those limits by developing new stiff, photocurable PDMS stamp materials with attached designed functionalities. Molecular modification of PDMS materials results in advanced soft lithography, which produces enhanced physical toughness, lower polymerization shrinkage, and photopatterning capability.

Original languageEnglish (US)
Article numberO6.2
Pages (from-to)147-154
Number of pages8
JournalMaterials Research Society Symposium Proceedings
Volume820
DOIs
StatePublished - Jan 1 2004
EventNanoengineered Assemblies and Advanced Micro/Nanosystems - San Francisco, CA, United States
Duration: Apr 13 2004Apr 16 2004

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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