Novel experimental and numerical investigations on bonding behaviour of crack interface in smart self-healing concrete

Caihong Xue, Wengui Li, Kejin Wang, Daichao Sheng, Surendra P. Shah, Surendra P. Shah

Research output: Contribution to journalArticlepeer-review

5 Scopus citations


There are crack interfaces between self-healing agent and cement matrix in smart encapsulation-based self-healing concrete, whose mechanical properties significantly affects the load capacity recovery of crack-healed concrete. In this study, both experimental and numerical investigations were conducted on the crack-healed concrete under uniaxial tension to investigate the interface bonding behaviours and the self-healing agent distribution on the crack surface. The results show that the bonding behaviour of the crack interface depends on the content of healing agent and mechanical properties of the crack surface. However, it is still difficult to accurately understand their effects on the bonding behaviour by experimental investigation due to the high brittleness of the crack interface and the discrepancy of self-healing concrete. Therefore, based on the experimental results, a novel numerical model of the interface between self-healing agent and cement matrix was developed to investigate effects of aggregates, pores and interface properties on the bonding behaviour of crack interface by the cohesive surface technique (CS). Parametric analysis was also performed on the bonding behaviours and a method was proposed for assessing the load capacity of crack-healed concrete. Based on the experimental and numerical investigations on the healing agent-concrete crack interface in the smart encapsulation-based self-healing concrete, this novel numericla methods can be used to assess the recovery efficiency and performance of smart self-healing concrete structure.

Original languageEnglish (US)
Article number085004
JournalSmart Materials and Structures
Issue number8
StatePublished - Aug 2020
Externally publishedYes


  • Self-healing concrete
  • bonding behavior
  • encapsulation-based agent
  • interface crack
  • microstructure
  • numerical modelling

ASJC Scopus subject areas

  • Signal Processing
  • Civil and Structural Engineering
  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Electrical and Electronic Engineering


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