Novel process for direct bonding of GaN onto glass substrates using sacrificial ZnO template layers to chemically lift-off GaN from c-sapphire

D. J. Rogers*, A. Ougazzaden, V. E. Sandana, T. Moudakir, A. Ahaitouf, F. Hosseini Teherani, S. Gautier, L. Goubert, I. A. Davidson, K. A. Prior, R. P. McClintock, P. Bove, H. J. Drouhin, M. Razeghi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

GaN was grown on ZnO-buffered c-sapphire (c-Al 2O 3) substrates by Metal Organic Vapor Phase Epitaxy. The ZnO then served as a sacrificial release layer, allowing chemical lift-off of the GaN from the c-Al 2O 3 substrate via selective wet etching of the ZnO. The GaN was subsequently direct-wafer-bonded onto a glass substrate. X-Ray Diffraction, Scanning Electron Microscopy, Energy Dispersive X-ray microanalysis, Room Temperature Photoluminescence & optical microscopy confirmed bonding of several mm 2 of crack-free wurtzite GaN films onto a soda lime glass microscope slide with no obvious deterioration of the GaN morphology. Using such an approach, InGaN based devices can be lifted-off expensive single crystal substrates and bonded onto supports with a better cost-performance profile. Moreover, the approach offers the possibility of reclaiming and reusing the substrate.

Original languageEnglish (US)
Title of host publicationOxide-Based Materials and Devices III
DOIs
StatePublished - Mar 23 2012
EventOxide-Based Materials and Devices III - San Francisco, CA, United States
Duration: Jan 22 2012Jan 25 2012

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8263
ISSN (Print)0277-786X

Other

OtherOxide-Based Materials and Devices III
CountryUnited States
CitySan Francisco, CA
Period1/22/121/25/12

Keywords

  • (In)GaN
  • Chemical Lift-off
  • Direct Wafer Bonding
  • Glass Substrate
  • LED
  • Multijunction Photovoltaic
  • Selective Wet Etching
  • ZnO

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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