Abstract
Most electronic systems are rigid and inflexible. Many applications, however, require or benefit from conformable designs. To create efficient conformable systems, multilayer stretchable interconnects are necessary. A novel strain relief structure for multilayer stretchable interconnects is proposed. The numerical analysis shows that the proposed structure will function indefinitely when stretched as much as 20% of its initial length. Electromechanical measurements demonstrate that the onset of microcrack formation in the interconnects occurs, on average, after 89% elongation. These measurements also show that the structures are able to withstand elongations of up to 285%. Additionally, precise failure mechanisms, including interconnect straightening and microcrack formation are documented.
Original language | English (US) |
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Article number | 6529126 |
Pages (from-to) | 2338-2345 |
Number of pages | 8 |
Journal | IEEE Transactions on Electron Devices |
Volume | 60 |
Issue number | 7 |
DOIs | |
State | Published - Jun 17 2013 |
Keywords
- Failure analysis
- finite element methods
- flexible electronics
- integrated circuit interconnections
- integrated circuit packaging
- materials reliability
- strain
- stress
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering