Novel strain relief design for multilayer thin film stretchable interconnects

Yung Yu Hsu, Kylie Lucas, Dan Davis, Brian Elolampi, Roozbeh Ghaffari, Conor Rafferty, Kevin Dowling

Research output: Contribution to journalArticlepeer-review

23 Scopus citations


Most electronic systems are rigid and inflexible. Many applications, however, require or benefit from conformable designs. To create efficient conformable systems, multilayer stretchable interconnects are necessary. A novel strain relief structure for multilayer stretchable interconnects is proposed. The numerical analysis shows that the proposed structure will function indefinitely when stretched as much as 20% of its initial length. Electromechanical measurements demonstrate that the onset of microcrack formation in the interconnects occurs, on average, after 89% elongation. These measurements also show that the structures are able to withstand elongations of up to 285%. Additionally, precise failure mechanisms, including interconnect straightening and microcrack formation are documented.

Original languageEnglish (US)
Article number6529126
Pages (from-to)2338-2345
Number of pages8
JournalIEEE Transactions on Electron Devices
Issue number7
StatePublished - 2013


  • Failure analysis
  • finite element methods
  • flexible electronics
  • integrated circuit interconnections
  • integrated circuit packaging
  • materials reliability
  • strain
  • stress

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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