Novel strain relief design for multilayer thin film stretchable interconnects

Yung Yu Hsu, Kylie Lucas, Dan Davis, Brian Elolampi, Roozbeh Ghaffari, Conor Rafferty, Kevin Dowling

Research output: Contribution to journalArticlepeer-review

17 Scopus citations

Abstract

Most electronic systems are rigid and inflexible. Many applications, however, require or benefit from conformable designs. To create efficient conformable systems, multilayer stretchable interconnects are necessary. A novel strain relief structure for multilayer stretchable interconnects is proposed. The numerical analysis shows that the proposed structure will function indefinitely when stretched as much as 20% of its initial length. Electromechanical measurements demonstrate that the onset of microcrack formation in the interconnects occurs, on average, after 89% elongation. These measurements also show that the structures are able to withstand elongations of up to 285%. Additionally, precise failure mechanisms, including interconnect straightening and microcrack formation are documented.

Original languageEnglish (US)
Article number6529126
Pages (from-to)2338-2345
Number of pages8
JournalIEEE Transactions on Electron Devices
Volume60
Issue number7
DOIs
StatePublished - Jun 17 2013

Keywords

  • Failure analysis
  • finite element methods
  • flexible electronics
  • integrated circuit interconnections
  • integrated circuit packaging
  • materials reliability
  • strain
  • stress

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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