Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate

R. A. Gagliano; G. Ghosh; M. E. Fine

doi:10.1007/s11664-002-0010-1

Nucleation kinetics of Cu₆Sn₅ by reaction of molten tin with a copper substrate

R. A. Gagliano^*, G. Ghosh, M. E. Fine

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

70 Scopus citations

Abstract

The nucleation kinetics of the η-phase (Cu₆Sn₅) intermetallic compound were investigated by hot dipping copper coupons in molten tin for 1 and 2 sec, at temperatures varying from 240°C to 300°C. In the scanning electron microscope (SEM), the Cu₆Sn₅ phase appears as small, rounded bumps of varying sizes, jutting out from the surface of the copper. The experimentally determined nucleation curves show the typical inverse C type behavior with a maximum nucleation rate occurring at an intermediate temperature. The role of surface finish on nucleation rate was also studied. Experimentally determined "effective nucleation rate" per unit area is presented and compared with theoretical predictions over the temperature range investigated. Relevant nucleation models and nucleation energetic parameters are also discussed.

Original language	English (US)
Pages (from-to)	1195-1202
Number of pages	8
Journal	Journal of Electronic Materials
Volume	31
Issue number	11
DOIs	https://doi.org/10.1007/s11664-002-0010-1
State	Published - Nov 2002

Keywords

Copper substrate
CuSn
Nucleation kinetics
Tin

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Access to Document

10.1007/s11664-002-0010-1

Cite this

@article{8c8bb1e4ad734d0cbca3dadc4ee36e81,

title = "Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate",

abstract = "The nucleation kinetics of the η-phase (Cu6Sn5) intermetallic compound were investigated by hot dipping copper coupons in molten tin for 1 and 2 sec, at temperatures varying from 240°C to 300°C. In the scanning electron microscope (SEM), the Cu6Sn5 phase appears as small, rounded bumps of varying sizes, jutting out from the surface of the copper. The experimentally determined nucleation curves show the typical inverse C type behavior with a maximum nucleation rate occurring at an intermediate temperature. The role of surface finish on nucleation rate was also studied. Experimentally determined {"}effective nucleation rate{"} per unit area is presented and compared with theoretical predictions over the temperature range investigated. Relevant nucleation models and nucleation energetic parameters are also discussed.",

keywords = "Copper substrate, CuSn, Nucleation kinetics, Tin",

author = "Gagliano, {R. A.} and G. Ghosh and Fine, {M. E.}",

note = "Funding Information: This research was sponsored by the National Science Foundation under Grant No. DMR 9813919.",

year = "2002",

month = nov,

doi = "10.1007/s11664-002-0010-1",

language = "English (US)",

volume = "31",

pages = "1195--1202",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "11",

}

TY - JOUR

T1 - Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate

AU - Gagliano, R. A.

AU - Ghosh, G.

AU - Fine, M. E.

N1 - Funding Information: This research was sponsored by the National Science Foundation under Grant No. DMR 9813919.

PY - 2002/11

Y1 - 2002/11

N2 - The nucleation kinetics of the η-phase (Cu6Sn5) intermetallic compound were investigated by hot dipping copper coupons in molten tin for 1 and 2 sec, at temperatures varying from 240°C to 300°C. In the scanning electron microscope (SEM), the Cu6Sn5 phase appears as small, rounded bumps of varying sizes, jutting out from the surface of the copper. The experimentally determined nucleation curves show the typical inverse C type behavior with a maximum nucleation rate occurring at an intermediate temperature. The role of surface finish on nucleation rate was also studied. Experimentally determined "effective nucleation rate" per unit area is presented and compared with theoretical predictions over the temperature range investigated. Relevant nucleation models and nucleation energetic parameters are also discussed.

AB - The nucleation kinetics of the η-phase (Cu6Sn5) intermetallic compound were investigated by hot dipping copper coupons in molten tin for 1 and 2 sec, at temperatures varying from 240°C to 300°C. In the scanning electron microscope (SEM), the Cu6Sn5 phase appears as small, rounded bumps of varying sizes, jutting out from the surface of the copper. The experimentally determined nucleation curves show the typical inverse C type behavior with a maximum nucleation rate occurring at an intermediate temperature. The role of surface finish on nucleation rate was also studied. Experimentally determined "effective nucleation rate" per unit area is presented and compared with theoretical predictions over the temperature range investigated. Relevant nucleation models and nucleation energetic parameters are also discussed.

KW - Copper substrate

KW - CuSn

KW - Nucleation kinetics

KW - Tin

UR - http://www.scopus.com/inward/record.url?scp=0036865846&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036865846&partnerID=8YFLogxK

U2 - 10.1007/s11664-002-0010-1

DO - 10.1007/s11664-002-0010-1

M3 - Article

AN - SCOPUS:0036865846

SN - 0361-5235

VL - 31

SP - 1195

EP - 1202

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 11

ER -