Numerical simulation of stretchable and foldable silicon integrated circuits

Zhuangjian Liu*, Yongwei Zhang, Jizhou Song, Dae Hyeong Kim, Yonggang Huang, John Rogers

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents numerical simulation strategies for stretchable silicon integrated circuits that use stiff thin film on elastomeric substrates. Detailed numerical simulation studies reveal the key underlying aspects of these systems. The results indicate, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of up to ∼90%. Simple circuits, including CMOS inverters provide an example that validates these designs. The results suggest practical routes to high performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies.

Original languageEnglish (US)
Title of host publicationNEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009
Pages197-200
Number of pages4
DOIs
StatePublished - Dec 1 2009
EventInternational Conference on Materials for Advanced Technologies, ICMAT 2009 - Singpore, Singapore
Duration: Jun 28 2009Jul 3 2009

Publication series

NameAdvanced Materials Research
Volume74
ISSN (Print)1022-6680

Other

OtherInternational Conference on Materials for Advanced Technologies, ICMAT 2009
CountrySingapore
CitySingpore
Period6/28/097/3/09

Fingerprint

Integrated circuits
Silicon
Computer simulation
Networks (circuits)
Mechanics
Electronic equipment
Thin films
Substrates

Keywords

  • Buckling
  • Finite element analysis
  • Flexible electronics
  • Stretchable electronics

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Liu, Z., Zhang, Y., Song, J., Kim, D. H., Huang, Y., & Rogers, J. (2009). Numerical simulation of stretchable and foldable silicon integrated circuits. In NEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009 (pp. 197-200). (Advanced Materials Research; Vol. 74). https://doi.org/10.4028/www.scientific.net/AMR.74.197
Liu, Zhuangjian ; Zhang, Yongwei ; Song, Jizhou ; Kim, Dae Hyeong ; Huang, Yonggang ; Rogers, John. / Numerical simulation of stretchable and foldable silicon integrated circuits. NEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009. 2009. pp. 197-200 (Advanced Materials Research).
@inproceedings{ced291ac79654d8db518c96ea441f2ac,
title = "Numerical simulation of stretchable and foldable silicon integrated circuits",
abstract = "This paper presents numerical simulation strategies for stretchable silicon integrated circuits that use stiff thin film on elastomeric substrates. Detailed numerical simulation studies reveal the key underlying aspects of these systems. The results indicate, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2{\%} even for applied strains of up to ∼90{\%}. Simple circuits, including CMOS inverters provide an example that validates these designs. The results suggest practical routes to high performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies.",
keywords = "Buckling, Finite element analysis, Flexible electronics, Stretchable electronics",
author = "Zhuangjian Liu and Yongwei Zhang and Jizhou Song and Kim, {Dae Hyeong} and Yonggang Huang and John Rogers",
year = "2009",
month = "12",
day = "1",
doi = "10.4028/www.scientific.net/AMR.74.197",
language = "English (US)",
isbn = "0878493212",
series = "Advanced Materials Research",
pages = "197--200",
booktitle = "NEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009",

}

Liu, Z, Zhang, Y, Song, J, Kim, DH, Huang, Y & Rogers, J 2009, Numerical simulation of stretchable and foldable silicon integrated circuits. in NEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009. Advanced Materials Research, vol. 74, pp. 197-200, International Conference on Materials for Advanced Technologies, ICMAT 2009, Singpore, Singapore, 6/28/09. https://doi.org/10.4028/www.scientific.net/AMR.74.197

Numerical simulation of stretchable and foldable silicon integrated circuits. / Liu, Zhuangjian; Zhang, Yongwei; Song, Jizhou; Kim, Dae Hyeong; Huang, Yonggang; Rogers, John.

NEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009. 2009. p. 197-200 (Advanced Materials Research; Vol. 74).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Numerical simulation of stretchable and foldable silicon integrated circuits

AU - Liu, Zhuangjian

AU - Zhang, Yongwei

AU - Song, Jizhou

AU - Kim, Dae Hyeong

AU - Huang, Yonggang

AU - Rogers, John

PY - 2009/12/1

Y1 - 2009/12/1

N2 - This paper presents numerical simulation strategies for stretchable silicon integrated circuits that use stiff thin film on elastomeric substrates. Detailed numerical simulation studies reveal the key underlying aspects of these systems. The results indicate, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of up to ∼90%. Simple circuits, including CMOS inverters provide an example that validates these designs. The results suggest practical routes to high performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies.

AB - This paper presents numerical simulation strategies for stretchable silicon integrated circuits that use stiff thin film on elastomeric substrates. Detailed numerical simulation studies reveal the key underlying aspects of these systems. The results indicate, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of up to ∼90%. Simple circuits, including CMOS inverters provide an example that validates these designs. The results suggest practical routes to high performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies.

KW - Buckling

KW - Finite element analysis

KW - Flexible electronics

KW - Stretchable electronics

UR - http://www.scopus.com/inward/record.url?scp=73549103856&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=73549103856&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMR.74.197

DO - 10.4028/www.scientific.net/AMR.74.197

M3 - Conference contribution

SN - 0878493212

SN - 9780878493210

T3 - Advanced Materials Research

SP - 197

EP - 200

BT - NEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009

ER -

Liu Z, Zhang Y, Song J, Kim DH, Huang Y, Rogers J. Numerical simulation of stretchable and foldable silicon integrated circuits. In NEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009. 2009. p. 197-200. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.74.197