Abstract
Current methodologies used for the inference of thin film stress through system curvature measurements are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/sub strate system. Recently Huang, Rosakis, and co-workers [Acta Mech. Sinica, 21, pp. 362-370 (2005); J. Mech. Phys. Solids, 53, 2483-2500 (2005); Thin Solid Films, 515, pp. 2220-2229 (2006); J. Appl. Meek, in press; J. Mech. Mater. Struct., in press] established methods for the film/substrate system subject to nonuniform misfit strain and temperature changes. The film stresses were found to depend nonlocally on system curvatures (i.e., depend on the full-field curvatures). These methods, however, all assume uniform substrate thickness, which is sometimes violated in the thin film/substrate system. Using the perturbation analysis, we extend the methods to nonuniform substrate thickness for the thin film/substrate system subject to nonuniform misfit strain.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1276-1281 |
| Number of pages | 6 |
| Journal | Journal of Applied Mechanics, Transactions ASME |
| Volume | 74 |
| Issue number | 6 |
| DOIs | |
| State | Published - Nov 1 2007 |
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Keywords
- Interfacial shears
- Nonlocal stress-curvature relations
- Nonuniform misfit strain
- Nonuniform substrate thickness
- Thin films
ASJC Scopus subject areas
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Cite this
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On the stoney formula for a thin film/substrate system with nonuniform substrate thickness. / Feng, X.; Huang, Y.; Rosakis, A. J.
In: Journal of Applied Mechanics, Transactions ASME, Vol. 74, No. 6, 01.11.2007, p. 1276-1281.Research output: Contribution to journal › Article
TY - JOUR
T1 - On the stoney formula for a thin film/substrate system with nonuniform substrate thickness
AU - Feng, X.
AU - Huang, Y.
AU - Rosakis, A. J.
PY - 2007/11/1
Y1 - 2007/11/1
N2 - Current methodologies used for the inference of thin film stress through system curvature measurements are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/sub strate system. Recently Huang, Rosakis, and co-workers [Acta Mech. Sinica, 21, pp. 362-370 (2005); J. Mech. Phys. Solids, 53, 2483-2500 (2005); Thin Solid Films, 515, pp. 2220-2229 (2006); J. Appl. Meek, in press; J. Mech. Mater. Struct., in press] established methods for the film/substrate system subject to nonuniform misfit strain and temperature changes. The film stresses were found to depend nonlocally on system curvatures (i.e., depend on the full-field curvatures). These methods, however, all assume uniform substrate thickness, which is sometimes violated in the thin film/substrate system. Using the perturbation analysis, we extend the methods to nonuniform substrate thickness for the thin film/substrate system subject to nonuniform misfit strain.
AB - Current methodologies used for the inference of thin film stress through system curvature measurements are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/sub strate system. Recently Huang, Rosakis, and co-workers [Acta Mech. Sinica, 21, pp. 362-370 (2005); J. Mech. Phys. Solids, 53, 2483-2500 (2005); Thin Solid Films, 515, pp. 2220-2229 (2006); J. Appl. Meek, in press; J. Mech. Mater. Struct., in press] established methods for the film/substrate system subject to nonuniform misfit strain and temperature changes. The film stresses were found to depend nonlocally on system curvatures (i.e., depend on the full-field curvatures). These methods, however, all assume uniform substrate thickness, which is sometimes violated in the thin film/substrate system. Using the perturbation analysis, we extend the methods to nonuniform substrate thickness for the thin film/substrate system subject to nonuniform misfit strain.
KW - Interfacial shears
KW - Nonlocal stress-curvature relations
KW - Nonuniform misfit strain
KW - Nonuniform substrate thickness
KW - Thin films
UR - http://www.scopus.com/inward/record.url?scp=38049150813&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=38049150813&partnerID=8YFLogxK
U2 - 10.1115/1.2745392
DO - 10.1115/1.2745392
M3 - Article
AN - SCOPUS:38049150813
VL - 74
SP - 1276
EP - 1281
JO - Journal of Applied Mechanics, Transactions ASME
JF - Journal of Applied Mechanics, Transactions ASME
SN - 0021-8936
IS - 6
ER -