TY - GEN
T1 - Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers
AU - Long, Jieyi
AU - Memik, Seda Ogrenci
AU - Grayson, Matthew
PY - 2010
Y1 - 2010
N2 - In this paper, we explore the design and optimization of an on-chip active cooling system based on thin-film thermoelectric coolers (TEC). We start our investigation by establishing the compact thermal model for the chip package with integrated thin-film TEC devices. We observe that deploying an excessive number of TEC devices and/or providing the TEC devices with an improper supply current might adversely result in the overheating of the chip, rendering the cooling system ineffective. A large amount of supply current could even cause the thermal runaway of the system. Motivated by this observation, we formulate the deployment of the integrated TEC devices and their supply current setting as a system-level design problem. We propose a greedy algorithm to determine the deployment of TEC devices and a convex programming based scheme for setting the supply current levels. Leveraging the theory of inverse-positive matrix, we provide an optimality condition for the current setting algorithm. We have tested our algorithms on various benchmarks. We observe that our algorithms are able to determine the proper deployment and supply current level of the TEC devices which reduces the temperatures of the hot spots by as much as 7.5 °C compared to the cases without integrated TEC devices.
AB - In this paper, we explore the design and optimization of an on-chip active cooling system based on thin-film thermoelectric coolers (TEC). We start our investigation by establishing the compact thermal model for the chip package with integrated thin-film TEC devices. We observe that deploying an excessive number of TEC devices and/or providing the TEC devices with an improper supply current might adversely result in the overheating of the chip, rendering the cooling system ineffective. A large amount of supply current could even cause the thermal runaway of the system. Motivated by this observation, we formulate the deployment of the integrated TEC devices and their supply current setting as a system-level design problem. We propose a greedy algorithm to determine the deployment of TEC devices and a convex programming based scheme for setting the supply current levels. Leveraging the theory of inverse-positive matrix, we provide an optimality condition for the current setting algorithm. We have tested our algorithms on various benchmarks. We observe that our algorithms are able to determine the proper deployment and supply current level of the TEC devices which reduces the temperatures of the hot spots by as much as 7.5 °C compared to the cases without integrated TEC devices.
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M3 - Conference contribution
AN - SCOPUS:77953102967
SN - 9783981080162
T3 - Proceedings -Design, Automation and Test in Europe, DATE
SP - 117
EP - 122
BT - DATE 10 - Design, Automation and Test in Europe
T2 - Design, Automation and Test in Europe Conference and Exhibition, DATE 2010
Y2 - 8 March 2010 through 12 March 2010
ER -