Opto-electronic packaging of 2-D surface active devices

Nagesh R. Basavanhally; Michael F. Brady; D. Bruce Buchholz

Opto-electronic packaging of 2-D surface active devices

Nagesh R. Basavanhally^*, Michael F. Brady, D. Bruce Buchholz

^*Corresponding author for this work

MRC - Materials Research Center

Research output: Contribution to conference › Paper › peer-review

1 Scopus citations

Abstract

A packaging technique which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is a cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices.

Original language	English (US)
Pages	215-216
Number of pages	2
State	Published - 1994
Event	Proceedings of the 1994 IEEE LEOS Annual Meeting. Part 1 (of 2) - Boston, MA, USA Duration: Oct 31 1994 → Nov 3 1994

Other

Other	Proceedings of the 1994 IEEE LEOS Annual Meeting. Part 1 (of 2)
City	Boston, MA, USA
Period	10/31/94 → 11/3/94

ASJC Scopus subject areas

General Engineering

Cite this

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title = "Opto-electronic packaging of 2-D surface active devices",

abstract = "A packaging technique which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is a cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices.",

author = "Basavanhally, {Nagesh R.} and Brady, {Michael F.} and Buchholz, {D. Bruce}",

year = "1994",

language = "English (US)",

pages = "215--216",

note = "Proceedings of the 1994 IEEE LEOS Annual Meeting. Part 1 (of 2) ; Conference date: 31-10-1994 Through 03-11-1994",

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TY - CONF

T1 - Opto-electronic packaging of 2-D surface active devices

AU - Basavanhally, Nagesh R.

AU - Brady, Michael F.

AU - Buchholz, D. Bruce

PY - 1994

Y1 - 1994

N2 - A packaging technique which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is a cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices.

AB - A packaging technique which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is a cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices.

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M3 - Paper

AN - SCOPUS:0028711617

SP - 215

EP - 216

T2 - Proceedings of the 1994 IEEE LEOS Annual Meeting. Part 1 (of 2)

Y2 - 31 October 1994 through 3 November 1994

ER -

Opto-electronic packaging of 2-D surface active devices

Abstract

Other

ASJC Scopus subject areas

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