Parka: Thermally insulated nanophotonic interconnects

Yigit Demir, Nikos Hardavellas

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Silicon-photonics are emerging as the prime candidate technology for energy-efficient on-chip interconnects at future process nodes. However, current designs are primarily based on microrings, which are highly sensitive to temperature. As a result, current silicon-photonic interconnect designs expend a significant amount of energy heating the microrings to a designated narrow temperature range, only to have the majority of the thermal energy waste away and dissipate through the heat sink, and in the process of doing so heat up the logic layer, causing significant performance degradation to the cores and inducing thermal emergencies. We propose Parka, a nanophotonic interconnect that encases the photonic die in a thermal insulator that keeps its temperature stable with low energy expenditure, while minimizing the spatial and temporal thermal coupling between logic and silicon-photonic components. Parka reduces the microring energy by 3.8-5.4x and achieves 11-23% speedup on average (34% max) depending on the cooling solution used.

Original languageEnglish (US)
Title of host publicationProceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015
EditorsDiana Marculescu, Andre Ivanov, Partha Pratim Pande, Jose Flich
PublisherAssociation for Computing Machinery, Inc
ISBN (Electronic)9781450333962
DOIs
StatePublished - Sep 28 2015
Event9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015 - Vancouver, Canada
Duration: Sep 28 2015Sep 30 2015

Publication series

NameProceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015

Other

Other9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015
CountryCanada
CityVancouver
Period9/28/159/30/15

Fingerprint

Nanophotonics
Photonics
Silicon
Heat sinks
Thermal energy
Temperature
Cooling
Heating
Degradation
Hot Temperature

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Demir, Y., & Hardavellas, N. (2015). Parka: Thermally insulated nanophotonic interconnects. In D. Marculescu, A. Ivanov, P. P. Pande, & J. Flich (Eds.), Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015 [2786597] (Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015). Association for Computing Machinery, Inc. https://doi.org/10.1145/2786572.2786597
Demir, Yigit ; Hardavellas, Nikos. / Parka : Thermally insulated nanophotonic interconnects. Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015. editor / Diana Marculescu ; Andre Ivanov ; Partha Pratim Pande ; Jose Flich. Association for Computing Machinery, Inc, 2015. (Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015).
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abstract = "Silicon-photonics are emerging as the prime candidate technology for energy-efficient on-chip interconnects at future process nodes. However, current designs are primarily based on microrings, which are highly sensitive to temperature. As a result, current silicon-photonic interconnect designs expend a significant amount of energy heating the microrings to a designated narrow temperature range, only to have the majority of the thermal energy waste away and dissipate through the heat sink, and in the process of doing so heat up the logic layer, causing significant performance degradation to the cores and inducing thermal emergencies. We propose Parka, a nanophotonic interconnect that encases the photonic die in a thermal insulator that keeps its temperature stable with low energy expenditure, while minimizing the spatial and temporal thermal coupling between logic and silicon-photonic components. Parka reduces the microring energy by 3.8-5.4x and achieves 11-23{\%} speedup on average (34{\%} max) depending on the cooling solution used.",
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Demir, Y & Hardavellas, N 2015, Parka: Thermally insulated nanophotonic interconnects. in D Marculescu, A Ivanov, PP Pande & J Flich (eds), Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015., 2786597, Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015, Association for Computing Machinery, Inc, 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015, Vancouver, Canada, 9/28/15. https://doi.org/10.1145/2786572.2786597

Parka : Thermally insulated nanophotonic interconnects. / Demir, Yigit; Hardavellas, Nikos.

Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015. ed. / Diana Marculescu; Andre Ivanov; Partha Pratim Pande; Jose Flich. Association for Computing Machinery, Inc, 2015. 2786597 (Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Demir Y, Hardavellas N. Parka: Thermally insulated nanophotonic interconnects. In Marculescu D, Ivanov A, Pande PP, Flich J, editors, Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015. Association for Computing Machinery, Inc. 2015. 2786597. (Proceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015). https://doi.org/10.1145/2786572.2786597